Hardware Design V1.00

Smart Machine Smart Decision
SIM2000S_Hardware_Design_V1.00 50 2014-02-27
7.3. The Moisture Sensitivity Level
The moisture sensitivity level of SIM2000S module is 3. The modules should be mounted within 168 hours after
unpacking in the environmental conditions of temperature <30℃ and relative humidity of <60% (RH). It is
necessary to bake the module if the above conditions are not met:
Table 48: Moisture sensitivity level and floor life
Moisture Sensitivity Level
(MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or as stated
1 Unlimited at ≦30℃/85% RH
2 1 year
2a 4 weeks
3 168 hours
4 72 hours
5 48 hours
5a 24 hours
6
Mandatory bake before use. After bake, it must be reflowed within the time limit
specified on the label.
Note:For product handling, storage, processing, IPC / JEDEC J-STD-033 must be followed.
7.4. Baking Requirements
SIM2000S modules are vacuum packaged, and guaranteed for 6 months storage without opening or leakage
under the following conditions: the environment temperature is lower than 40℃, and the air humidity is less than
90%.
If the condition meets one of the following shown below, the modules should be baked sufficiently before
re-flow soldering, and the baking condition is shown in the table below; otherwise the module will be at the risk
of permanent damage during re-flow soldering.
z If the vacuum package is broken or leaked;
z
If the vacuum package is opened after 6 months since it is packed;
z
If the vacuum package is opened within 6 months but out of its Floor Life at factory ambient≦30℃
/60%RH or as stated
.
Table 49: Baking requirements
Baking temperature Moisture Time
40 ±5℃℃ <5% 192 hours
120 ±5℃℃ <5% 6 hours
Note ： Care should be taken if the plastic tray is not heat-resistant, the modules should be taken out for
preheating, otherwise the tray may be damaged by high-temperature heating.