Users Manual Part 2

SIM8260A_Hardware Design_V1.05
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6.7 Baking Requirements
It is necessary to bake modules if the prescribed time limit has been exceeded. The baking conditions are
specified in Table 71. Note that if baking is required, the devices must be transferred into trays that can be
baked to at least 125°C.
The module is vacuum-packed and has a shelf life of 6 months when the temperature is less than 40
degrees and the relative humidity is less than 90%.
If any of the following three conditions are met, the module should be thoroughly baked before reflow
welding, as shown in Table 71. Otherwise, the module may be permanently damaged during reflow welding.
●Vacuum packing damaged or air leakage.
●When vacuum packing is opened in good condition, the storage time is more than 6 months (from the
date of packing).
● When the vacuum packaging is intact, the storage time of the vacuum packaging is not more than 6
months (calculated from the date of packaging), but the storage time of the vacuum packaging is more than
168 hours in the workshop with temperature <30°C and relative humidity <60%.
Table 75: Baking requirements
Baking conditions options
Duration
Note
40°C±5°C, <5% RH
192 hours
120°C±5°C, <5% RH
8 hours
Original pallet is not applicable
NOTE
The tray is not resistant to high temperature. If the customer's baking temperature is 120°C, the module
should be taken out of the tray for baking, otherwise the tray may be damaged by high temperature
NOTE