Users Manual Part 2

SIM8260A_Hardware Design_V1.05
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5.7 Thermal Design
Make sure that the SIM8260A can reach maximum work performance under extended temperature or
extreme conditions for a long time, thermal dissipation design is very important.
The thermal dissipation design of LGA is described in Figure as follows:
Figure 49: 3D drawing of LGA thermal dissipation design
There are some design rules to enhance thermal dissipation performance:
 Keep the module away from other heat sources such as battery, power, AP, etc.
 All the GND pins of the module should be connected.
 Add enough through GND via on the main PCB. Via material is very important solid copper and
stacked via is better.
 Make sure maximize airflow around the module.
 Recommend use heat dissipation material connect to the customers’ device on the top side of the
module to enhance the heat dissipation. Large heat dissipation area is better.
 Chose a high effective heat dissipation material is better such as heat pipe, graphite sheets.
Table 71: Chip junction temperature table
Chip model
Junction temperature
NM4484NSPAXAE-3F
85℃
PMK65
125℃
PMX65
125℃
SDX65/SDX62
105℃
QET7100
115℃