Users Manual Part 1

SIM8260A_Hardware Design_V1.05

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SPI interface



Only support master mode



Data rate up to 50Mbps

SDIO interface



Support 4bit SD card or 8bit eMMC, meet SDIO3.0 specification



1.8V or 3.0V dual-voltage operation for SD card



Clock output up to 200 MHz for SD card; up to 100 MHz for eMMC

USB interface

Support one USB controller, USB3.1 Gen2 or USB2.0

USB3.1: super speed, with data rate which up to 10Gbps

USB2.0: high speed interface, support USB operations at low-speed and

full-speed, which refer to USB1.0 and USB1.1

Firmware upgrade

Firmware upgrade over USB interface

Physical characteristics

Size: 41x43.6x2.8mm

SIM8260A weight：11.45g (typical)

Temperature range

Normal operation temperature: -30°C to +70°C (3GPP compliant)

Extended operation temperature: -40°C to +85°C

Storage temperature: -40°C to +90°C

1. “*” means under development,for more information, please connect the SIMCom FAE teams.

2. W82 is SIMCom WiFi-6 module.

3. When Module is within the extended operation temperature range, Module is able to establish and

maintain voice, data transmission, SMS and emergency call, etc. The performance may deviate

slightly from the 3GPP specifications and will meet 3GPP specifications again when the temperature

returns to normal operating temperature levels. It is strongly recommended that customers take heat

dissipation measures to ensure that the junction temperature of the chip can’t be exceeded (for

example, the temperature of the CPU cannot exceed 105°C).

NOTE