Specifications

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6.6 Moisture Sensitivity Level (MSL)
Module is susceptible to damage induced by absorbed moisture and high temperature. A package’s
moisture-sensitivity level (MSL) indicates its ability to withstand exposure after it is removed from its
shipment bag, while it is on the factory floor awaiting PCB installation. A low MSL rating is better than a high
rating; a low MSL device can be exposed on the factory floor longer than a high MSL device. All pertinent
MSL ratings are summarized in Table 51.
Table 51: MSL ratings summary
MSL
Out-of-bag floor life
Comments
1
Unlimited
≤+30℃/85% RH
2
1 year
≤+30℃/60% RH
2a
4 weeks
≤+30℃/60% RH
3
168 hours
≤+30℃/60% RH
4
72 hours
≤+30℃/60% RH
5
48 hours
≤+30℃/60% RH
5a
24 hours
≤+30℃/60% RH
6
Mandatory bake before use. After bake, it must be
reflowed within the time limit specified on the label.
≤+30℃/60% RH
The device samples are currently classified as MSL3 at 255 (+5, -0)°C, following the latest IPC/JEDEC
J-STD-020 standard revision for moisture-sensitivity qualification This qualification temperature (255°C)
should not be confused with the peak temperature within the recommended solder reflow profile.
6.7 Baking Requirements
It is necessary to bake modules if the prescribed time limit has been exceeded. The baking conditions are
specified in Table 52. Note that if baking is required, the devices must be transferred into trays that can be
baked to at least 125°C.
Table 52: Baking requirements
Baking conditions options
Duration
40°C±5°C, <5% RH
192 hours
120°C±5°C, <5% RH
4 hours