Specifications

SIM7912&SIM7906 Hardware Design V1.02
www.simcom.com 68 / 85
5.6 Conducted Receive Sensitivity
Module conducted RF receiving sensitivity is fully meet 3GPP specification. Customers can get more
details by check 3GPP official website
http://www.3gpp.org/.
5.7 Thermal Design
Make sure that the module can reach maximum work performance under extended temperature or extreme
conditions for a long time, thermal dissipation design is very important.
There are some design rules to enhance thermal dissipation performance:
 Keep the module away from other heat sources such as battery, power, AP, etc.
 All the GND pins of the module should be connected.
 Add enough through GND via on the main PCB. Via material is very important solid copper and
stacked via is better.
 Make sure maximize airflow around the module.
 Recommend use heat dissipation material connect to the customers’ device on the top side of the
module to enhance the heat dissipation. Large heat dissipation area is better.
 Chose a high effective heat dissipation material is better such as heat pipe, graphite sheets.
5.8 ESD
Module is sensitive to ESD in the process of storage, transporting, and assembling. When module is
mounted on the customers’ main board, the ESD components should be placed closed to the connectors
which human body may touch, such as SIM card socket, SD card socket, audio jacks, switches, USB
interface, etc. The following table shows the module ESD measurement performance.
Table 49: The ESD performance measurement table (temperature: 25℃, humidity: 45%)
Part
Contact discharge(kV)
Air discharge(kV)
VBAT, GND
±4
±8
Antenna Interfaces
±4
±8
Other PADs
±2
±4
Test conditions:
1. The external of the module has surge protection diodes and ESD protection diodes.
NOTE