User's Manual
Table Of Contents
- 1.Introduction
- 2.Package Information
- 3.Interface Application
- 4.RF Specifications
- 5.Electrical Specifications
- 6.SMT Production Guide
- 7.Packaging
- 8.Appendix
SIM7075G User Manual V1.00
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5
48 hours at ≦30℃/60% RH
5a
24 hours at ≦30℃/60% RH
6
Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.
6.5 Baking
In order to get better yield, the module need to bake before SMT.
If the packaging is in perfect condition, the module which dateofproduction is within six months has no
use for baking. If the dateofproduction is more thansix months, the module must be baking.
If the packaging had been opened or damaged, the module must be baking.
Table 40: Baking conditions
conditions
parameters
Baking temperature
120℃
Baking time
8 hours
IPC / JEDEC J-STD-033standard must be followed for production and storage.
NOTE










