User's Manual
Table Of Contents
- Contents
- Table Index
- Figure Index
- 1Introduction
- 1.1Product Outline
- 1.2Hardware Interface Overview
- 1.3Hardware Block Diagram
- 1.4Functional Overview
- 2Package Information
- 2.1.Pin Assignment Overview
- 2.2.Pin Description
- 2.3.Mechanical Information
- 2.4.Footprint Recommendation
- 3Interface Application
- 3.1Power Supply
- 3.3UART Interface
- 3.4USB Interface
- 3.5SIM Interface
- 3.6PCM Interface
- 3.7I2C Interface
- 3.8SPI Interface
- 3.9Network status
- 3.10ADC interface
- 3.11LDO output
- 3.12USB_BOOT Interface
- 3.13GPIO Interface
- 3.14 RF control Interface
- 3.15Force USB Download Interface
- 4RF Specifications
- 4.1LTE RF Specifications
- 4.2LTE Antenna Design Guide
- 4.3GNSS
- 4.4RF traces note
- 5 Electrical Specifications
- 5.1Absolute maximum ratings
- 5.2Operating conditions
- 5.3Operating Mode
- 5.4Current Consumption
- 5.5ESD Notes
- 6 SMT Production Guide
- 6.1Top and Bottom View of SIM7090G
- 6.2Label Information
- 6.3Typical SMT Reflow Profile
- 6.5Baking
- 6.6Stencil Foil Design Recommendation
- 7 Packaging
- 7.1Tray packaging
- 8 Appendix
- 8.1Coding Schemes and Maximum Net Data Rates over Air
- 8.2Related Documents
- 8.3Terms and Abbreviations
- 8.4Safety Caution
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6.5 Baking
In order to get better yield, the module need to bake before SMT.
If the packaging is in perfect condition, the module which date of production is within six months
has no use for baking. If the date of production is more than six months, the module must be
baking.
If the packaging had been opened or damaged, the module must be baking.
Table 43: Baking conditions
conditions
parameters
Baking temperature
120℃
Baking time
8 hours
IPC / JEDEC J-STD-033 standard must be followed for production and storage.
NOTE