User's Manual
Table Of Contents
- Contents
- Table Index
- Figure Index
- 1Introduction
- 1.1Product Outline
- 1.2Hardware Interface Overview
- 1.3Hardware Block Diagram
- 1.4Functional Overview
- 2Package Information
- 2.1.Pin Assignment Overview
- 2.2.Pin Description
- 2.3.Mechanical Information
- 2.4.Footprint Recommendation
- 3Interface Application
- 3.1Power Supply
- 3.3UART Interface
- 3.4USB Interface
- 3.5SIM Interface
- 3.6PCM Interface
- 3.7I2C Interface
- 3.8SPI Interface
- 3.9Network status
- 3.10ADC interface
- 3.11LDO output
- 3.12USB_BOOT Interface
- 3.13GPIO Interface
- 3.14 RF control Interface
- 3.15Force USB Download Interface
- 4RF Specifications
- 4.1LTE RF Specifications
- 4.2LTE Antenna Design Guide
- 4.3GNSS
- 4.4RF traces note
- 5 Electrical Specifications
- 5.1Absolute maximum ratings
- 5.2Operating conditions
- 5.3Operating Mode
- 5.4Current Consumption
- 5.5ESD Notes
- 6 SMT Production Guide
- 6.1Top and Bottom View of SIM7090G
- 6.2Label Information
- 6.3Typical SMT Reflow Profile
- 6.5Baking
- 6.6Stencil Foil Design Recommendation
- 7 Packaging
- 7.1Tray packaging
- 8 Appendix
- 8.1Coding Schemes and Maximum Net Data Rates over Air
- 8.2Related Documents
- 8.3Terms and Abbreviations
- 8.4Safety Caution
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6.4 Moisture Sensitivity Level (MSL)
SIM7090G is qualified to Moisture Sensitivity Level (MSL) 3 in accordance with JEDEC J-STD-033.
The following table shows the features of Moisture Sensitivity Level (MSL). After seal off, storage conditions
must meet the following table. If the storage time was expired, module must be baking before SMT.
Table 42: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity
Level (MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH
or as stated
1
Unlimited at ≦30℃/85% RH
2
1 year at ≦30℃/60% RH
2a
4 weeks at ≦30℃/60% RH
3
168 hours at ≦30℃/60% RH
4
72 hours at ≦30℃/60% RH
5
48 hours at ≦30℃/60% RH
5a
24 hours at ≦30℃/60% RH
6
Mandatory bake before use. After bake, it must be reflowed within the
time limit specified on the label.