User's Manual
Table Of Contents
- Contents
- Table Index
- Figure Index
- 1Introduction
- 1.1Product Outline
- 1.2Hardware Interface Overview
- 1.3Hardware Block Diagram
- 1.4Functional Overview
- 2Package Information
- 2.1.Pin Assignment Overview
- 2.2.Pin Description
- 2.3.Mechanical Information
- 2.4.Footprint Recommendation
- 3Interface Application
- 3.1Power Supply
- 3.3UART Interface
- 3.4USB Interface
- 3.5SIM Interface
- 3.6PCM Interface
- 3.7I2C Interface
- 3.8SPI Interface
- 3.9Network status
- 3.10ADC interface
- 3.11LDO output
- 3.12USB_BOOT Interface
- 3.13GPIO Interface
- 3.14 RF control Interface
- 3.15Force USB Download Interface
- 4RF Specifications
- 4.1LTE RF Specifications
- 4.2LTE Antenna Design Guide
- 4.3GNSS
- 4.4RF traces note
- 5 Electrical Specifications
- 5.1Absolute maximum ratings
- 5.2Operating conditions
- 5.3Operating Mode
- 5.4Current Consumption
- 5.5ESD Notes
- 6 SMT Production Guide
- 6.1Top and Bottom View of SIM7090G
- 6.2Label Information
- 6.3Typical SMT Reflow Profile
- 6.5Baking
- 6.6Stencil Foil Design Recommendation
- 7 Packaging
- 7.1Tray packaging
- 8 Appendix
- 8.1Coding Schemes and Maximum Net Data Rates over Air
- 8.2Related Documents
- 8.3Terms and Abbreviations
- 8.4Safety Caution
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6.3 Typical SMT Reflow Profile
SIMCom provides a typical soldering profile. Therefore the soldering profile shown below is only a generic
recommendation and should be adjusted to the specific application and manufacturing constraints.
Figure 33: The ramp-soak-spike reflow profile of SIM7090G
For more details about secondary SMT, please refer to the document [19].
NOTE