Specifications
Table Of Contents
- 1Introduction
- 1.1Product Outline
- 1.2Hardware Interface Overview
- 1.3Hardware Block Diagram
- 1.4Functional Overview
- 2Package Information
- 2.1Pin Assignment Overview
- 2.2Pin Description
- 2.3Mechanical Information
- 2.4Footprint Recommendation
- 3Interface Application
- 3.1Power Supply
- 3.3WAKEUP Description
- 3.5UART Interface
- 3.6RI signal behaviors
- 3.7ADC
- 3.8SIM Card Interface
- 3.9Network Status
- 4Operation Mode
- 4.1Operating mode
- 4.2PSM
- 4.3PSM wake up
- 5RF Specifications
- 5.1LTE RF Specifications
- 5.2LTE Antenna Design Guide
- 5.3RF Layout Design Guide
- 6Electrical Specifications
- 6.1Normal Operating Conditions
- 6.2Current Consumption
- 6.3ESD Notes
- 7SMT Production Guide
- 7.1Top and Bottom View of SIM7028
- 7.2Typical SMT Reflow Profile
- 7.4Baking
- 8Packaging
- 8.1Tray packaging
- 9Appendix
SIM7028 Hardware Design V1.00
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Table 25: Moisture Sensitivity Level and Floor Life
Moisture Sensitivity
Level (MSL)
Floor Life (out of bag) at factory ambient≤30°C/60% RH or
as stated
1
Unlimited at ≦30℃/85% RH
2
1 year at ≦30℃/60% RH
2a
4 weeks at ≦30℃/60% RH
3
168 hours at ≦30℃/60% RH
4
72 hours at ≦30℃/60% RH
5
48 hours at ≦30℃/60% RH
5a
24 hours at ≦30℃/60% RH
6
Mandatory bake before use. After bake, it must be re-flowed within the
time limit specified on the label.
7.4 Baking
In order to get better yield, the module need to bake before SMT.
If the packaging is in perfect condition, the module which dateofproduction is within six months has no
use for baking. If the dateofproduction is more than six months, the module must be baking.
If the packaging had been opened or damaged, the module must be baking.
Table 26: Baking conditions
Conditions
Parameters
Baking temperature
120℃
Baking time
8 hours
IPC / JEDEC J-STD-033standard must be followed for production and storage.
NOTE