Datasheet

DDR3(L) SODIMM
Product Datasheet
Rev. 1.0 Oct.2016
9
Q-RD-402-A4
DDR3L STU Series Module Specification ( Single DIMM Package)
Part Number
Module Density
& Configuration
Bandwidth Data Rate
Timing
Operator
Voltage
(tCL-tRCD-tRP)
SP001GLSTU106T01(2)
1GB (128Mx64)
128Mx16 1Rank
PC3L-8500 DDR3L-1066 7-7-7 1.35V
SP001GLSTU133T01(2) PC3L-10600 DDR3L-1333 9-9-9 1.35V
SP001GLSTU160T01(2) PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP002GLSTU106T01(2)
2GB (256Mx64)
128Mx16 2Ranks
PC3L-8500 DDR3L-1066 7-7-7 1.35V
SP002GLSTU133T01(2) PC3L-10600 DDR3L-1333 9-9-9 1.35V
SP002GLSTU160T01(2) PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP002GLSTU106W01(2)
2GB (256Mx64)
256Mx16 1Rank
PC3L-8500 DDR3L-1066 7-7-7 1.35V
SP002GLSTU133W01(2) PC3L-10600 DDR3L-1333 9-9-9 1.35V
SP002GLSTU160W01(2) PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP004GLSTU106W01(2)
4GB (512Mx64)
256Mx16 2Ranks
PC3L-8500 DDR3L-1066 7-7-7 1.35V
SP004GLSTU133W01(2) PC3L-10600 DDR3L-1333 9-9-9 1.35V
SP004GLSTU160W01(2) PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP002GLSTU133V01(2)
2GB (256Mx64)
256Mx8 1Rank
PC3L-10600 DDR3L-1333 9-9-9 1.35V
SP002GLSTU160V01(2) PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP004GLSTU133V01(2)
4GB (512Mx64)
256Mx8 2Ranks
PC3L-10600 DDR3L-1333 9-9-9 1.35V
SP004GLSTU160V01(2) PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP004GLSTU133N01(2)
4GB (512Mx64)
512Mx8 1Rank
PC3L-10600 DDR3L-1333 9-9-9 1.35V
SP004GLSTU160N01(2) PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP004GLSTU160N02DA
4GB (512Mx64)
512Mx8 1Rank
PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP008GLSTU133N01(2)
8GB (1Gx64)
512Mx8 2Ranks
PC3L-10600 DDR3L-1333 9-9-9 1.35V
SP008GLSTU160N01(2) PC3L-12800 DDR3L-1600 11-11-11 1.35V
SP008GLSTU160N02DA
8GB (1Gx64)
512Mx8 2Ranks
PC3L-12800 DDR3L-1600 11-11-11 1.35V
Note:
1. This document supports all LSTU Series DDR3L 204Pin SODIMM products.
2. Some item was being EOL in this list, Please contact with our sales Dep.
3. There are two solutions (SDP & DDP) for each 2 ranks module.
SDP: DRAM use Single DIE Package. In this solution, there are 16 DRAM chips on module.
DDP: DRAM use Single DIE Package. In this solution, there are 8 DRAM chips on module.