Data Sheet
Table Of Contents
- 1. Feature List
- 2. Ordering Information
- 3. System Overview
- 4. Electrical Characteristics
- 4.1 Absolute Maximum Ratings
- 4.2 General Operating Conditions
- 4.3 MCU Current Consumption with 3 V Supply
- 4.4 Radio Current Consumption with 3 V Supply
- 4.5 RF Transmitter General Characteristics for the 2.4 GHz Band
- 4.6 RF Receiver General Characteristics for the 2.4 GHz Band
- 4.7 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 1 Mbps Data Rate
- 4.8 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 2 Mbps Data Rate
- 4.9 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 500 kbps Data Rate
- 4.10 RF Receiver Characteristics for Bluetooth Low Energy in the 2.4 GHz Band 125 kbps Data Rate
- 4.11 High-Frequency Crystal
- 4.12 Low-Frequency Crystal
- 4.13 Precision Low Frequency RC Oscillator (LFRCO)
- 4.14 GPIO Pins
- 4.15 Microcontroller Peripherals
- 4.16 Typical Performance Curves
- 5. Reference Diagrams
- 6. Pin Definitions
- 7. Design Guidelines
- 8. Package Specifications
- 9. Soldering Recommendations
- 10. Tape and Reel
- 11. Certifications
- 12. Revision History
Confidential
11. Certifications
This section details the regulatory certification status of the module in various regions.
The address for the module manufacturer and certification applicant is:
SILICON LABORATORIES FINLAND OY
Alberga Business Park, Bertel Jungin aukio 3,
02600 Espoo, Finland
11.1 Qualified Antennas
BGM220P modules have been tested and certified with the on-board chip antenna. Performance characteristics for the chip antenna
are presented in Table 3.1 Antenna Efficiency and Peak Gain on page 7 and 4.16.1 Antenna Radiation and Efficiency.
11.2 EU - CE
The BGM220P modules are in conformity with the essential requirements and other relevant requirements of the Radio Equipment Di-
rective (RED) (2014/53/EU).
Please note that every application using the BGM220P module will need to perform the radio EMC tests on the end product, according
to EN 301 489-17.
It is ultimately the responsibility of the manufacturer to ensure the compliance of the end-product as a whole. The specific product as-
sembly may have an impact to RF radiated characteristics, and manufacturers should carefully consider RF radiated testing with the
end-product assembly.
A formal Declaration of Conformity (DoC) is available at the product web page which is reachable starting from https://www.silabs.com/.
11.3 USA - FCC
This device complies with Part 15 of the FCC Rules when operating with the embedded antenna. Operation is subject to the following
two conditions:
1. This device may not cause harmful interference, and
2. This device must accept any interference received, including interference that may cause undesirable operation.
Any changes or modifications not expressly approved by Silicon Labs could void the user’s authority to operate the equipment.
FCC RF Radiation Exposure Statement
This equipment complies with FCC radiation exposure limits set forth for an uncontrolled environment. End users must follow the specif-
ic operating instructions for satisfying RF exposure compliance.
This transmitter meets the Mobile requirements at a distance of 20 cm and above from the human body, in accordance to the limit(s)
exposed in the RF Exposure Analysis.
This transmitter also meets the Portable requirements at distances equal or above those listed for convenience in Table 11.1 Minimum
Separation Distances for SAR Evaluation Exemption on page 45.
This transmitter must not be co-located or operating in conjunction with any other antenna or transmitter except in accordance with FCC
multi-transmitter product procedures.
BGM220P Wireless Gecko Bluetooth Module Data Sheet
Certifications
silabs.com | Building a more connected world. Preliminary Rev. 0.5 | 40