Data Sheet
Table Of Contents
- 1. Features
- 2. Ordering Information
- 3. System Overview
- 4. Electrical Specifications
- 4.1 Absolute Maximum Ratings
- 4.2 General Operating Conditions
- 4.3 MCU Current Consumption at 3.0V
- 4.4 Radio Current Consumption at 3.0V
- 4.5 RF Transmitter General Characteristics
- 4.6 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
- 4.7 RF Receiver General Characteristics
- 4.8 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
- 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps
- 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps
- 4.11 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps
- 4.12 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps
- 4.13 High-Frequency Crystal
- 4.14 GPIO Pins
- 4.15 Microcontroller Peripherals
- 4.16 Typical Performance Curves
- 5. Reference Diagrams
- 6. Pin Definitions
- 7. Design Guidelines
- 8. Package Specifications
- 9. Soldering Recommendations
- 10. Tape and Reel
- 11. Certifications
- 12. Revision History
8.3 Package Marking
The figure below shows the module markings engraved on the RF shield.
Figure 8.4. MGM210P Top Marking
Mark Description
The package marking consists of:
• MGM210Pxxxxxxx - Part number designation
• Model: MGM210Pxxx - Model number designation
• QR Code: YYWWMMABCDE
• YY – Last two digits of the assembly year.
• WW – Two-digit workweek when the device was assembled.
• MMABCDE – Silicon Labs unit code
• YYWWTTTTTT
• YY – Last two digits of the assembly year.
• WW – Two-digit workweek when the device was assembled.
• TTTTTT – Manufacturing trace code. The first letter is the device revision.
• Certification marks such as the CE logo, FCC and IC IDs, etc will be engraved in the gray area according to regulatory body require-
ments
MGM210P Mighty Gecko Module Data Sheet
Package Specifications
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