Data Sheet
Table Of Contents
- 1. Features
- 2. Ordering Information
- 3. System Overview
- 4. Electrical Specifications
- 4.1 Absolute Maximum Ratings
- 4.2 General Operating Conditions
- 4.3 MCU Current Consumption at 3.0V
- 4.4 Radio Current Consumption at 3.0V
- 4.5 RF Transmitter General Characteristics
- 4.6 RF Transmitter Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
- 4.7 RF Receiver General Characteristics
- 4.8 RF Receiver Characteristics for 802.15.4 DSSS-OQPSK in the 2.4 GHz Band
- 4.9 RF Receiver Characteristics for Bluetooth Low Energy at 1 Mbps
- 4.10 RF Receiver Characteristics for Bluetooth Low Energy at 2 Mbps
- 4.11 RF Receiver Characteristics for Bluetooth Low Energy at 500 kbps
- 4.12 RF Receiver Characteristics for Bluetooth Low Energy at 125 kbps
- 4.13 High-Frequency Crystal
- 4.14 GPIO Pins
- 4.15 Microcontroller Peripherals
- 4.16 Typical Performance Curves
- 5. Reference Diagrams
- 6. Pin Definitions
- 7. Design Guidelines
- 8. Package Specifications
- 9. Soldering Recommendations
- 10. Tape and Reel
- 11. Certifications
- 12. Revision History
1. Features
• Supported Protocols
• Zigbee
• Thread
• Bluetooth 5.1
• Bluetooth Mesh
• Multi-protocol (Zigbee + Bluetooth 5.1)
• Wireless System-on-Chip
• 2.4 GHz radio
• TX power up to +20 dBm
•
32-bit ARM Cortex
®
-M33 with DSP instruction and floating-
point unit for efficient signal processing
• 1024 kB flash program memory
• 96 kB RAM data memory
• Embedded Trace Macrocell (ETM) for advanced debugging
• Receiver Performance
• -103.9 dBm sensitivity (1% PER) at 250 kbps O-QPSK
DSSS
• -104.5 dBm sensitivity (0.1% BER) at 125 kbps GFSK
• -100.1 dBm sensitivity (0.1% BER) at 500 kbps GFSK
• -97.0 dBm sensitivity (0.1% BER) at 1 Mbps GFSK
• -94.1 dBm sensitivity (0.1% BER) at 2 Mbps GFSK
• Current Consumption
• 9.4 mA RX current at 250 kbps O-QPSK DSSS
• 9.3 mA RX current at 1 Mbps GFSK
• 16.1 mA TX current at 0 dBm (MGM210Px22)
• 34.1 mA TX current at 10 dBm (MGM210Px22)
• 181.3 mA TX current at 20 dBm (MGM210Px32)
• 50.9 µA/MHz in Active Mode (EM0)
• 5.1 μA EM2 DeepSleep current (RTCC running from LFXO,
Bluetooth Stack not running)
• 8.5 μA EM2 DeepSleep current (RTCC running from LFXO,
Bluetooth Stack running)
• Regulatory Certifications
• CE
• ISED
• FCC
• Operating Range
• 1.8 to 3.8 V
• -40 to +125°C
• Dimensions
• 12.9 mm x 15.0 mm x 2.2 mm
• Security
•
Secure Boot with Root of Trust and Secure Loader (RTSL)
1
• Hardware Cryptographic Acceleration with DPA counter-
measures
1
for AES128/256, SHA-1, SHA-2 (up to 256-bit),
ECC (up to 256-bit), ECDSA, and ECDH
• True Random Number Generator (TRNG) compliant with
NIST SP800-90 and AIS-31
•
ARM
®
TrustZone
®
• Secure Debug Interface lock/unlock
• MCU Peripherals
• 12-bit 1 Msps SAR Analog to Digital Converter (ADC)
• 2 × Analog Comparator (ACMP)
• 20 General Purpose I/O pins with output state retention and
asynchronous interrupts
• 8 Channel DMA Controller
• 12 Channel Peripheral Reflex System (PRS)
• 2 × 16-bit Timer/Counter
(3 Compare/Capture/PWM channels)
• 1 × 32-bit Timer/Counter
(3 Compare/Capture/PWM channels)
• 32-bit Real Time Counter
• 24-bit Low Energy Timer for waveform generation
• 2 × Watchdog Timer
• 3 × Universal Synchronous/Asynchronous Receiver/Trans-
mitter (UART/SPI/SmartCard (ISO 7816)/IrDA/I
2
S)
•
2 × I
2
C interface with SMBus support
1. With Secure Element (SE) firmware v1.1.2 or newer
MGM210P Mighty Gecko Module Data Sheet
Features
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