Datasheet

Si5351A/B/C-B
Rev. 1.0 9
Table 9. Thermal Characteristics
Parameter Symbol Test Condition Package Value Unit
Thermal Resistance
Junction to Ambient

JA
Still Air
10-MSOP 131 °C/W
20-QFN 119 °C/W
Thermal Resistance
Junction to Case

JC
Still Air 20-QFN 16 °C/W
Table 10. Absolute Maximum Ratings
1
Parameter Symbol Test Condition Value Unit
DC Supply Voltage V
DD_max
–0.5 to 3.8 V
Input Voltage
V
IN_CLKIN
CLKIN, SCL, SDA –0.5 to 3.8 V
V
IN_VC
VC –0.5 to (VDD+0.3) V
V
IN_XA/B
Pins XA, XB –0.5 to 1.3 V V
Junction Temperature T
J
–55 to 150 °C
Soldering Temperature (Pb-free
profile)
2
T
PEAK
260 °C
Soldering Temperature Time at
TPEAK (Pb-free profile)
2
T
P
20–40 Sec
Notes:
1. Permanent device damage may occur if the absolute maximum ratings are exceeded. Functional operation should be
restricted to the conditions as specified in the operational sections of this data sheet. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
2. The device is compliant with JEDEC J-STD-020.