Datasheet

Si5351A/B/C-B
Rev. 1.0 39
14.3. 10-Pin MSOP Top Marking
Figure 29. 10-Pin MSOP Top Marking
14.4. Top Marking Explanation
Mark Method: Laser
Pin 1 Mark: Mold Dimple (Bottom-Left Corner)
Font Size: 0.60 mm (24 mils)
Line 1 Mark Format Device Part Number Si5351
Line 2 Mark Format: TTTT = Mfg Code* Line 2 from the “Markings” section of the Assembly
Purchase Order form.
Line 3 Mark Format: YWW = Date Code Assigned by the Assembly House.
Y = Last Digit of Current Year (Ex: 2013 = 3)
WW = Work Week of Assembly Date.
*Note: The code shown in the “TTTT” line does not correspond to the orderable part number or frequency plan. It is used for
package assembly quality tracking purposes only.