Specifications

Si2493
Rev. 1.3 53
12. Package Outline: 24-Pin TSSOP
Figure 14 illustrates the package details for the Si2493 24-pin packaging option. Table 15 lists the values for the
dimensions shown in the illustration.
Figure 14. 24-Pin Thin Shrink Small Outline Package (TSSOP)
Table 15. Package Diagram Dimensions
Dimension Min Nom Max
A——1.20
A1 0.05 — 0.15
A2 0.80 1.00 1.05
b 0.19 — 0.30
c 0.09 — 0.20
D 7.70 7.80 7.90
E 6.40 BSC
E1 4.30 4.40 4.50
e 0.65 BSC
L 0.45 0.60 0.75
L2 0.25 BSC
θ 0° — 8°
aaa 0.10
bbb 0.10
ccc 0.20
Notes:
1. All dimensions shown are in millimeters (mm) unless otherwise noted.
2. Dimensioning and Tolerancing per ANSI Y14.5M-1994.
3. This drawing conforms to the JEDEC Solid State Outline MO-153,
Variation AD.
4. Recommended card reflow profile is per the JEDEC/IPC J-STD-020
specification for Small Body Components.