Specifications

Si2457/34/15/04
Rev. 1.3 55
13. 24-Pin TSSOP Land Pattern
Figure 22 illustrates the recommended land pattern for the Si2457/34/15/04 24-Pin TSSOP. Table 16 lists the
values for the dimensions shown in the illustration.
Figure 22. 24-Pin TSSOP Land Pattern Diagram
Table 16. 24-Pin TSSOP PCB Land Pattern
Dimension Feature (mm)
C1 Pad Column Spacing 5.80
E Pad Row Pitch 0.65
X1 Pad Width 0.45
Y1 Pad Length 1.40
Notes:
1. This Land Pattern Design is based on IPC-7351 specifications for Density Level B
(Median Land Protrusion).
2. All feature sizes shown are at Maximum Material Condition (MMC) and a card
fabrication tolerance of 0.05 mm is assumed.
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