Specifications

Si2404
Rev. 0.91 65
Package Outline: 24-Pin TSSOP
Figure 7 illustrates the package details for the Si2404. Table 19 lists the values for the dimensions shown in the
illustration.
Figure 7. 24-Pin Thin Shrink Small Outline Package (TSSOP)
Table 19. Package Diagram Dimensions
Symbol
Millimeters
Typical*Min Max
A 1.20 3
A1 0.05 0.15 3
B0.190.30
C0.090.20 3
D7.707.90
E4.304.50
e 0.65 BSC
H 6.40 BSC
L0.450.75
θ 3
γ 0.10
bbb 0.10
ddd 0.20
*Note: To guarantee coplanarity (γ), the parameters
marked “Typical” may be exceeded.
Approximate device weight is 115.7 mg.
γ
E
B
D
L
θ
C
A
A1
ABddd C
H
A
e
B
C
ABCbbb
(2x)