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Silicon Laboratories Finland Oy
Page 8 of 45
Pad name
Pad
number
Pad type
Description
NC
1, 52
Not connected
Pins 1 and 52 are not present on the footprint
RESET
33
Digital input
Active low reset with weak internal pull-up. Keep
low for >5ms to reset module
GND
2-10, 16, 23,
24, 26-28,
30, 31, 36,
44-49, 53-
59
Ground
Ground pads should all be connected to a ground
plane with minimum trace length, especially on the
antenna end of the module
RF
51
Not connected
No internal connection
RFGND
50
Ground
Connect to ground plane
VDD_PA
11
Supply voltage
Supply voltage for the RF power amplifier and low
noise amplifier
VDD
32
Supply voltage
Supply voltage for the Bluetooth chipset
Table 2: Supply and RF Terminal Descriptions
PIO signal
Pad number
Description
PIO[2]
12
Bi-directional digital in/out with programmable strength and pull-up/pull-
down
PIO[3]
13
Bi-directional digital in/out with programmable strength and pull-up/pull-
down
PIO[4]
29
Bi-directional digital in/out with programmable strength and pull-up/pull-
down
PIO[5]
41
Bi-directional digital in/out with programmable strength and pull-up/pull-
down
PIO[6]
34
Bi-directional digital in/out with programmable strength and pull-up/pull-
down
PIO[7]
35
Bi-directional digital in/out with programmable strength and pull-up/pull-
down
AIO[1]
43
Bi-directional analog in/out
Table 3: GPIO Terminal Descriptions