User's Manual

Table Of Contents
8. BGM113 Package Specifications ....................... 61
8.1 BGM113 Dimensions ...........................61
8.2 BGM113 PCB Land Pattern .........................62
8.3 BGM113 Package Marking .........................63
9. Certifications .............................. 64
9.1 Bluetooth ...............................64
9.2 CE..................................64
9.3 FCC .................................64
9.4 IC ..................................66
9.5 Japan ................................67
9.6 KC (South-Korea) ............................67
10. Revision History............................. 68
10.1 Revision 0.93 .............................68
10.2 Revision 0.92 .............................68
10.3 Revision 0.91 .............................68
10.4 Revision 0.9 ..............................68
10.5 Revision 0.8 ..............................68
10.6 Revision 0.7 ..............................68
Table of Contents .............................. 69
Table of Contents 71