Specifications

Product Technical Specification & Customer Design Guidelines
74 Proprietary and Confidential - Contents subject to change 4114634
Keep very low capacitance traces on the USIM_DATA and USIM_CLK
signals.
SIM implementation on
page 33
To minimize noise leakage, establish a very good ground connection
between the module and host.
Ground connection on page 43
Route cables away from noise sources (for example, power supplies,
LCD assemblies, etc.).
Methods to mitigate decreased
Rx performance on page 44
Shield high RF-emitting components of the host device (for example,
main processor, parallel bus, etc.).
Methods to mitigate decreased
Rx performance on page 44
Use discrete filtering on low frequency lines to filter out unwanted high-
order harmonic energy.
Methods to mitigate decreased
Rx performance on page 44
Use multi-layer PCBs to form shielding layers around high-speed clock
traces.
Methods to mitigate decreased
Rx performance on page 44
Thermal
Test to worst case operating conditionstemperature, voltage, and
operation mode (transmitter on 100% duty cycle, maximum power).
Thermal considerations on
page 64
Use appropriate techniques to reduce module temperatures (for example,
airflow, heat sinks, heat-relief tape, module placement, etc.).
Thermal considerations on
page 64
Host/Modem communication
Make sure the host USB driver supports remote wakeup, resume, and
suspend operations, and serial port emulation.
[4] AirCard/AirPrime USB
Driver Developer’s Guide
(Doc# 2130634)
When no valid data is being sent, do not send SOF tokens from the host
(causes unnecessary power consumption).
[4] AirCard/AirPrime USB
Driver Developer’s Guide
(Doc# 2130634)
Table B-1: Hardware integration design considerations (Continued)
Suggestion Section where discussed