Specifications

Product Technical Specification & Customer Design Guidelines

64 Proprietary and Confidential - Contents subject to change 4114634

• IMEI number in Code-128 barcode format

• SKU number (when required)

• Factory Serial Number (FSN) in alphanumeric format

• Manufacturing date code (incorporated into FSN)

• Licensed vendor logo

• Applicable certification marks/details (e.g. FCC ID, CE information, etc.

Example shows FCC ID.)

Note: The MC7304 supports OEM partner-specific label requirements.

Electrostatic discharge (ESD)

The OEM is responsible for ensuring that the Mini Card host interface pins are not

exposed to ESD during handling or normal operation. (See Table7-1 on page61

for specifications.)

ESD protection is highly recommended for the SIM connector at the point where

the contacts are exposed, and for any other signals from the host interface that

would be subjected to ESD by the user of the product. (The device includes ESD

protection on the antenna.)

Thermal considerations

Embedded modules can generate significant amounts of heat that must be

dissipated in the host device for safety and performance reasons.

Figure 7-4: Shield locations

The amount of thermal dissipation required depends on:

• Supply voltage—Maximum power dissipation for the module can be up to

3.5 W at voltage supply limits.

• Usage—Typical power dissipation values depend on the location within the

host product, throughput, amount of data transferred, etc.

Baseband