Specifications

Product Technical Specification & Customer Design Guidelines
62 Proprietary and Confidential - Contents subject to change 4114634
Device views
Figure 7-1: Top view
(Electrostatic discharge
(See Electrostatic
discharge (ESD) on
page 64.)
Operational The RF port (antenna launch and RF connector) complies
with the IEC 61000-4-2 standard:
• Electrostatic Discharge Immunity: Test: Level3
Contact Discharge: ±6 kV
Air Discharge: ±8 kV
Non-operational The host connector Interface complies with the following
standard only:
• minimum ±500 V Human Body Model
(JESD22-A114-B)
Thermal considerations See Thermal considerations on page 64.
Form factor PCI-Express Mini Card shielded with metal and metalized
fabric (F2 specification)
Dimensions Length: 50.95 mm
Width: 30 mm
Thickness: 2.75 mm (max)
Weight: 8.6 g
1. For class A and B operation, the internal module temperature must be kept below 100ºC; for best perfor-
mance, the temperature should be kept below 85ºC. Proper mounting, heat sinks and active cooling may be
required, depending on the integrated application.
Table 7-1: Mechanical and environmental specifications (Continued)
Mode Details