User manual
GHI Electronics,LLC Embedded Master User Manual
Embedded Master design Consideration
4.3.1 Machine Placement
When electrical components are machine placed, they go under very high temperature
very quickly and for a short time. This is needed to reflow the components. Device that
are not sealed from humidity should be baked before they are to be used in machine
placement. This is a standard procedure and Embedded Master needs to go in this
process as well.
Also, Embedded Master is lead-free and lead-free solder requires higher temperature to
reflow. If Embedded Master module is to be placed on a leaded PCB then the
temperatures needed shouldn't be high enough to reflow (could damage) the
Embedded Master module itself. If the process is lead-free then the high temperatures
needed can reflow (can damage) the Embedded Master module. Users should select
assembly houses that have experience in placing these modules.
The soldering profile used on the lead-free development system is available for
reference.
Rev. 2.06 TFT Page 27 of 102 www.ghielectronics.com
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