Specifications

Rev 1 Dec.10 Proprietary and Confidential - Specifications subject to change 27
3.2 Ground connection
The AirPrime SL808X Embedded Module shielding case is the grounding. The
ground must be connected on the motherboard through a complete layer on the
PCB.
The ground connection is made by soldering the LGA ground pins and
rectangular ground pad to the ground plane of the application board. For more
information about ground connection, see Ground plane and shielding connection
on page 97.
3.3 Decoupling of power supply signals
Although the AirPrime SL808X Embedded Module has embedded decoupling
capacitors on the VCC_3V6 lines, additional decoupling may be required:
• EMI/RFI issues—Parallel 33 pF capacitors close to the embedded module.
• TDMA noise (217 Hz)—Low frequency decoupling capacitors (22–100 µF)
can be used to reduce noise.
3.4 Mechanical specifications
This section describes mechanical specifications for the AirPrime SL808X
Embedded Module. For additional mechanical and environmental specifications,
refer to [5] Sierra Wireless Reliability Specification.
Table 3-5: Mechanical specifications
Specification Details
Form factor The SL808X is a 74-pin LGA soldered-down module with a two-
piece shielded case.
Dimensions
(nominal)
Length: 30 mm
Width: 25 mm
Thickness: 2.40 mm (nominal)/2.55 mm (maximum)
Weight: approximately 3.5 g