Specifications

Rev 1 Dec.10 Proprietary and Confidential - Specifications subject to change 25
3
3: Technical Specifications
3.1 Power supply
Power is provided to the SL808X through power and ground pins as
detailed in Ta bl e 3 - 1.
The host device must provide power to the AirPrime soldered-down
module over pins 42 and 44 (VCC_3V6) as detailed in Tabl e 3- 2 .
Note: The host must provide safe and continuous power to the module; the
module does NOT have protection circuits to guard against electrical
overstress.
Table 3-1: Power and ground specifications
Signal/Pin
Name
Pins Type Specification Parameter Min Typ Max Units
VCC_3V6
a
42, 44 V Voltage range VCC 3.30 3.60 4.30 Va
Ripple voltage
(U
ripp
)
100 mV
pp
VREF_1V8 10 V Maximum supply
current = 1 mA
1.62 1.80 1.98 V
GND 19, 20, 21, 23,
28, 39, 35, 37,
38, 39, 52
V - 0 - V
a. Host-provided input voltage should provide 3 A instantaneous (lasting 5 ms) and 1.5 A continuous current, while staying
within specified min/max range.
Table 3-2: Power supply requirements
Requirement type Value
Power supply 3.6 V (nominal)
Voltage range (V
min
–V
max
) 3.3–4.3 V
Current (instantaneous (≤5 ms)) 3A
Current (continuous) 700 mA
a
(maximum)
Power input capacitor(s) • Add capacitance to host power rail (≥ 100 µF) to keep
module operational with V
in
in range.
• Additional capacitance may be required if the host cannot
meet the module’s current requirements.
• Conditioning capacitor (1 µF, 0.1 µF, 10 nF and 1 nF)
recommended close to the power input for decoupling.
a. Maximum current is for HSDPA mode; other modes will have lower continuous current. Average
value depends on usage model, antenna design, PCB layout, etc.