Specifications

Product Technical Specification & Customer Design Guidelines
70 Proprietary and Confidential - Contents subject to change 2400089
Provide ESD protection for the SIM connector at the exposed
contact point (in particular, the CLK, VCC, IO, and RESET lines).
SIM implementation on
page 34
Keep very low capacitance traces on the USIM_DATA and
USIM_CLK signals.
SIM implementation on
page 34
To minimize noise leakage, establish a very good ground
connection between the module and host.
Ground connection on page 41
Route cables away from noise sources (for example, power
supplies, LCD assemblies, etc.).
Methods to mitigate decreased
Rx performance on page 42
Shield high RF-emitting components of the host device (for
example, main processor, parallel bus, etc.).
Methods to mitigate decreased
Rx performance on page 42
Use discrete filtering on low frequency lines to filter out unwanted
high-order harmonic energy.
Methods to mitigate decreased
Rx performance on page 42
Use multi-layer PCBs to form shielding layers around high-speed
clock traces.
Methods to mitigate decreased
Rx performance on page 42
Thermal
Test to worst case operating conditions — temperature, voltage,
and operation mode (transmitter on 100% duty cycle, maximum
power).
Thermal considerations on
page 60
Use appropriate techniques to reduce module temperatures (for
example, airflow, heat sinks, heat-relief tape, module placement,
etc.).
Thermal considerations on
page 60
Host / Modem communication
Make sure the host USB driver supports remote wakeup,
resume, and suspend operations, and serial port emulation.
[5] AirCard / AirPrime USB
Driver Developer’s Guide
(Doc# 2130634)
When no valid data is being sent, do not send SOF tokens from
the host (causes unnecessary power consumption).
[5] AirCard / AirPrime USB
Driver Developer’s Guide
(Doc# 2130634)
Table B-1: Hardware integration design considerations (Continued)
Suggestion Section where discussed