Product Technical Specification & Customer Design Guidelines AirPrime MC7710 2400089 Rev 6 Contents subject to change
Preface Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Product Technical Specification & Customer Design Guidelines Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright ©2013 Sierra Wireless. All rights reserved. Trademarks AirCard® is a registered trademark of Sierra Wireless.
Preface Revision History Revision number Release date Changes 1 October 2010 Initial release. 2 May 2011 Draft release. 3 September 2011 Updated LED table Updated UMTS Tx and Rx test sequences Updated LTE power consumption Added suggested antenna part number 4 January 2013 Updated preface. Removed note indicating LTE Band 1 support was SKU-dependent. Added Windows 8 support. Corrected HSDPA data rate category. Corrected GPRS/EDGE class details.
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Contents Introduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Supported RF bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Physical features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Application interface features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 Packet mode features . . . . . . . . . . . . . . . . . . . .
Product Technical Specification & Customer Design Guidelines USB interface. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 31 USB high / full speed throughput performance . . . . . . . . . . . . . . . . . . . . . 31 User-developed drivers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 SIM interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32 SIM implementation . . . . . . .
Contents Power interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Power ramp-up . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Power-up timing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 53 Transmit power waveform (GSM) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 54 Power supply noise . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Product Technical Specification & Customer Design Guidelines Certification testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 72 Production testing . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Functional production test . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73 Production test procedure . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
List of Tables Table 1-1: Supported RF bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Table 1-2: Required host-module connectors . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Table 2-1: Supported GPRS / EDGE power classes. . . . . . . . . . . . . . . . . . . . . 22 Table 3-1: Standards compliance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Table 4-1: Connector pin assignments . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Product Technical Specification & Customer Design Guidelines Table 8-1: Mechanical and environmental specifications . . . . . . . . . . . . . . . . . 57 Table A-1: Antenna requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 65 Table A-2: GPS standalone antenna requirements . . . . . . . . . . . . . . . . . . . . . 67 Table B-1: Hardware integration design considerations . . . . . . . . . . . . . . . . . . 69 Table C-1: Test settings — Transmission path . . . . . . . . . . . . .
List of Figures Figure 4-1: System block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 Figure 4-2: Expanded RF block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Figure 4-3: SIM application interface . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 4-4: SIM card contacts (contact view) . . . . . . . . . . . . . . . . . . . . . . . . . . 33 Figure 4-5: Recommended WAKE_N connection . . . . . . . . . . . . . . . . . . . .
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1 1: Introduction The Sierra Wireless MC7710 PCI Express Mini Card is a compact, lightweight, wireless LTE- and UMTS-based modem. The MC7710 provides LTE, DC-HSPA+, HSPA+, HSDPA, HSUPA, WCDMA, GSM, GPRS, EDGE, and GPS connectivity for portable and handheld computers, point-of-sale devices, telemetry products and other machine-to-machine and vertical applications over several radio frequency bands.
Product Technical Specification & Customer Design Guidelines Application interface features • USB interface (QMI and Direct IP) • NDIS NIC interface support for Windows 7, Windows Vista, and Windows XP platforms • Support for Windows 8 in-box NDIS MBIM driver • Multiple non-multiplexed USB channel support • USB selective suspend to maximize power savings • AT command interface ([1] AT Command Set for User Equipment (UE) (Release 6) (Doc# 3GPP TS 27.
Introduction • Detach procedure · Network-initiated detach with reattach required · Network-initiated detach followed by connection release Short Message Service (SMS) features • Mobile-terminated SMS for UMTS • Mobile-originated SMS for UMTS • SMS over SGs (LTE) Position location (GPS) • Standalone mode • A-GPS SUPL1.0 • A-GPS SUPL2.
Product Technical Specification & Customer Design Guidelines For over-the-air LTE testing, ensure that suitable antennas are used. (Two antennas are required for this testing; Sierra Wireless offers an LTE-capable antenna covering 700–2600 MHz BW — please order part number 6000492 (Qty 1 — this contains two antennas).) Required connectors Table 1-2 describes the connectors used to integrate AirPrime MC-series modules into your host device.
Introduction Rev 6 Mar.13 • Service provisioning—Manufacturing process • Software—As discussed in Software Interface on page 55.
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2 2: Technology Overview LTE LTE (Long Term Evolution) is a 4th-generation wireless standard. The 3GPP Release 8 specification outlines the features and requirements. Key features include. • Peak data rate: · 100 Mbps DL within 20 MHz bandwidth (Peak DL data rate in 10 MHz bandwidth: 70 Mbps (approx.) for Cat 3 device) · 50 Mbps UL within 20 MHz bandwidth Actual throughput is dependent on the network configuration, bandwidth assigned to the UE, the number of users, and RF signal conditions.
Product Technical Specification & Customer Design Guidelines HSPA+ HSPA+ is an enhanced version of HSPA (High Speed Packet Access), as defined by the 3rd Generation Partnership Project (3GPP) Release 7 UMTS Specification for Mobile Terminated Equipment. Using improved modulation schemes and refined data communication protocols, HSPA+ permits increased uplink and downlink data rates.
3 3: Standards Compliance The MC7710 Mini Card complies with the mandatory requirements described in the following standards. The exact set of requirements supported is carrier-dependent. Table 3-1: Standards compliance Technology Standards LTE • 3GPP Release 8 UMTS • 3GPP Release 5 • 3GPP Release 6 • 3GPP Release 7 • 3GPP Release 8 GSM / GPRS / EDGE • • Rev 6 Mar.
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4 4: Electrical Specifications The system block diagram in Figure 4-1 represents the MC7710 module integrated into a host system. The module includes the following interfaces to the host: • Power — Supplied to the module by the host. • W_DISABLE_N — Active low input from a hardware switch to the MC7710 that disables the main RF radio. • GPS_EN_N — Active low input from a hardware switch to the • WAKE_N— Signal used to wake the host when specific events MC7710 that disables the GPS radio. occur.
Product Technical Specification & Customer Design Guidelines VCTCXO TCXO_RTR VCTCXO_DFF RF BLOCK PA_BOOST_EN VGA_MONITOR VGA_UMTS_MONITOR PCB ID PCB_ID_1 PCB_ID_0 GPIO55 GPIO8 GPIO56 XO_OUT_EN PMIC_SSBI PM_INT_N MDM9200 GPIO57 HW_ID_2 HW Rev ID HW_ID_3 HW_ID_4 HW_ID_5 MFG_MODE0_N MFG MODE MFG_MODE1_N MFG_MODE2_N USIM VPH/ VBAT GPIO65 GPIO66 GPIO69 GPIO_3 GPIO70 GPIO_4 GPIO25 WAKE_N GPIO24 HSUSB GPIO23 GPIO102 GPS_EN_N XO_OUT_A0 VCC_3.
Electrical Specifications B7 PRX_HB TX_HB TX_LB1 PRX_ I TX_LB3 B20 PA B8 PA B3 PA B1 PA B3 PRX_MB2 TX_MB3 PRX_MB1 DAC REF PA B8 + GSM900 PRX_LB2 PRX_Q B7 B20 PRX_LB1 RF Main Connector SP10T B1 TX_MB4 TX_I TX_Q DRX_MB1 Jammer Det GSM1800 + GSM1900 GSM850/900 TX_LB4 PA TCXO GSM1800/1900 TX_MB1 RTR_SSB Power Det DRX_I DRX_Q DRX_LB1 B20d + B8d B20 SP2T B8 RF Diversity/MIMO/GPS Connector 2 DRX_MB2 B3d B3 SP5T Diplexer DRX_HB B1 B1d + B7d SP2T B7 GPS GNSS_I GNSS LNA SP2
Product Technical Specification & Customer Design Guidelines Note: The following table describes the internal structure of the module. GPIO pins are reserved for future use. For applications not requiring GPIO functionality, leave these pins not connected on the host. Table 4-1: Connector pin assignments 1 Pin Signal name 1 WAKE_N 2 VCC 3 GPIO1 Pin type 2 3 Description Direction to module Voltage levels (V) Active state Min Typ Max Wake host Output Low - - 0.2 V 3.
Electrical Specifications Table 4-1: Connector pin assignments 1 (Continued) Pin 14 Signal name USIM_RST Pin type - 2 Description SIM Reset Direction to module Output Voltage levels (V) Active state Min Typ Max Low 0 - 0.45 High 2.55 (3V SIM) - 3.0 (3V SIM) 1.35 (1.8V SIM) 1.8 (1.
Product Technical Specification & Customer Design Guidelines Table 4-1: Connector pin assignments 1 (Continued) Pin Signal name Pin type 2 Description Direction to module Voltage levels (V) Active state Min Typ Max 43 GND V Ground Input Power - 0 - 44 GPIO3 - General purpose I/O Input high - 1.17 1.80 2.10 Input low - -0.3 - 0.63 Output high - 1.35 - 1.80 Output low - 0 - 0.
Electrical Specifications Power supply The host provides power to the MC7710 through multiple power and ground pins as summarized in Table 4-2. The host must provide safe and continuous power at all times; the module does not have an independent power supply, or protection circuits to guard against electrical issues. Table 4-2: Power and ground specifications Name Pins Specification Min VCC 2, 24, 39, 41, 52 Voltage range See Table 4-1 on page 28.
Product Technical Specification & Customer Design Guidelines be characterized by the OEM. Note that throughput will be reduced and may vary significantly based on packet size, host interface, and firmware revision. Sierra Wireless does not recommend using this device in USB full speed mode. User-developed drivers If you will be developing your own USB drivers, see [5] AirCard / AirPrime USB Driver Developer’s Guide (Doc# 2130634). SIM interface The module supports one SIM (Subscriber Identity Module) (1.
Electrical Specifications USIM_PWR 4.7uF X5R typ 0.1uF (Optional. Locate near the SIM socket) 15 k - 30 k Located near SIM socket (Optional. Locate near the SIM socket) 47 pF, 51 USIM_CLK (C1) (C3) USIM_DATA (C7) USIM_RST (C2) USIM_GND (C5) SIM card connector AirPrime embedded module Located near SIM socket.
Product Technical Specification & Customer Design Guidelines SIM implementation Note: For interface design requirements, refer to: (2G) 3GPP TS 51.010-1, section 27.17, or (3G) ETSI TS 102 230 V5.5.0, section 5.2. 34 When designing the remote SIM interface, you must make sure that SIM signal integrity is not compromised.
Electrical Specifications Control interface (Signals) The MC7710 provides signals for: • Waking the host when specific events occur • Power control of the module from the host • LED driver output These signals are summarized in Table 4-5 and paragraphs that follow. Table 4-5: Module control signals Name Pin Description Type 1 WAKE_N2 1 Wake host O W_DISABLE_N 20 Wireless disable (Main RF) PU WLAN_LED_N 42 LED driver O GPS_EN_N2 51 Wireless disable (GPS) PU 1.
Product Technical Specification & Customer Design Guidelines W_DISABLE_N and GPS_EN_N — Wireless disable The host device uses: • W_DISABLE_N (pin 20) to enable / disable the WWAN or radio modem. When • GPS_EN_N (pin 51) to enable / disable GPS functionality on the device. disabled, the modem cannot transmit or receive information. (Support for this signal is firmware dependent. Contact your Sierra Wireless account representative to determine specific availability.
Electrical Specifications WLAN_LED_N — LED output The module drives the LED output according to [10] PCI Express Mini Card Electromechanical Specification Revision 1.2, as described in Table 4-6 (below). If desired, LED behavior can be configured using AT!LEDCTRL. Table 4-6: LED states (Default behavior) LED behavior !LEDCTRL index State Period (s) On Off Description Off 0 0% 100% Module is not powered.
Product Technical Specification & Customer Design Guidelines Digital interface The MC7710 Mini Card provides the general purpose digital I/O (GPIO) signals listed in Table 4-7: • By default, all GPIO pins are set as inputs. • Voltage should not be applied until > 1s after VCC is applied to the minicard. • GPIO pins are available for OEM-defined purposes but may, in future firmware releases, be allocated by Sierra Wireless for specific functionality.
5 5: RF Specifications The MC7710 includes three RF connectors for use with host-supplied antennas: • Main RF connector — Rx / Tx path • GPS connector 1 — Standalone GPS • Diversity / MIMO / GPS connector 2— Diversity, MIMO, or GPS The module does not have integrated antennas.
Product Technical Specification & Customer Design Guidelines Antenna and cabling When selecting the antenna and cable, it is critical to RF performance to match antenna gain and cable loss. Note: For detailed electrical performance criteria, see Appendix A: Antenna Specification on page 65.
RF Specifications Ground connection When connecting the module to system ground: • Prevent noise leakage by establishing a very good ground connection to the module through the host connector. • Connect to system ground using the two mounting holes at the top of the module (shown in Figure 5-1 on page 39). • Minimize ground noise leakage into the RF. Depending on the host board design, noise could potentially be coupled to the module from the host board.
Product Technical Specification & Customer Design Guidelines Proximity of host electronics to the antenna in wireless devices can contribute to decreased Rx performance. Components that are most likely to cause this include: • Microprocessor and memory • Display panel and display drivers • Switching-mode power supplies Device-generated RF interference The module can cause interference with other devices.
RF Specifications Note: GSM spurious emissions are most likely to have RSE issues, but in general, RSE requirements must be met on all models with user-designed antennas. Radiated sensitivity measurement A wireless host device contains many noise sources that contribute to a reduction in Rx performance. To determine the extent of any receiver performance desensitization due to selfgenerated noise in the host device, over-the-air (OTA) or radiated testing is required.
Product Technical Specification & Customer Design Guidelines • Radio transceiver requirements for 3GPP Release 7 • Inter-RAT and inter-frequency cell reselection and handover between supported frequency bands Table 5-1: LTE frequency band support Band Frequencies Band 1 Tx: 1920–1980 MHz Rx: 2110-2170 MHz Band 3 Tx: 1710–1785 MHz Rx: 1805–1880 MHz Band 7 Tx: 2500–2570 MHz Rx: 2620–2690 MHz Band 8 Tx: 880–915 MHz Rx: 925–960 MHz Band 20 Tx: 832–862 MHz Rx: 791–821 MHz Table 5-2: LTE bandwidt
RF Specifications Table 5-4: GSM frequency band support Band Frequencies EGSM 900 Tx: 880–915 MHz Rx: 925–960 MHz GSM 1800 Tx: 1710–1785 MHz Rx: 1805–1880 MHz GSM 1900 Tx: 1850–1910 MHz Rx: 1930–1990 MHz Conducted Rx sensitivity / Tx power Table 5-5: Conducted Rx (Receive) sensitivity — LTE bands Conducted Rx sensitivity (dBm) LTE bands Primary (Typical) LTE Band 1 SIMO (Typical) Secondary (Typical) SIMO 1 (Worst case) -98.5 -98.5 -101.5 -96.3 -100.0 -99.0 TBD -93.3 -97.5 -98.
Product Technical Specification & Customer Design Guidelines Table 5-7: Conducted Rx (Receive) sensitivity — GSM / EDGE bands Conducted Rx sensitivity (dBm) GSM / EDGE bands 2% BER DCS 1800 10% BLER 2% BER PCS 1900 10% BLER Typical Worst case CS1 -108 -102 GMSK (CS1) -111 -104 EDGE (MCS5) -101 -98 CS1 -108 -102 GMSK (CS1) -111 -104 EDGE (MCS5) -101 -98 1.
RF Specifications GPS specifications Note: For detailed electrical performance criteria, see Recommended GPS antenna specifications on page 67. Table 5-9: GPS specifications 1 Parameter/feature Description Satellite channels 12 channel, continuous tracking Protocols NMEA 0183 V3.0 Acquisition time Hot start: 1 s Warm start: 29 s Cold start: 32 s Accuracy Horizontal: < 2 m (50%); < 5 m (90%) Altitude: < 4 m (50%); < 8 m (90%) Velocity: < 0.
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6 6: Power Power consumption Note: All specifications in these tables are preliminary, based on chipset published expectations. Power consumption measurements in the tables below are for the MC7710 Mini Card module connected to the host PC via USB. The module does not have its own power source and depends on the host device for power. For a description of input voltage requirements, see Power supply on page 31.
Product Technical Specification & Customer Design Guidelines Table 6-2: Averaged call mode DC power consumption (LTE / WCDMA / HSUPA) 1 Current Band 2 Signal Description VCC Data current consumption (includes USB bus current) LTE category 3 WCDMA LTE bands UMTS bands HSUPA (1.8 / 3.6 / 7.2 / 21.
Power Table 6-4: Miscellaneous DC power consumption 1 Current Signal Description Typ Unit Notes / configuration Max Module OFF leakage current 490 830 A Full operating temperature range USB active current 18 25 mA High speed USB connection, CL = 50 pF on D+ and D- signals VCC Inrush current GPS signal connector 750 Active bias on GPS port 3000 mA 3.3 (100 mA) V • Assumes power supply turn on time > 100µs • Dependent on host power supply rise time.
Product Technical Specification & Customer Design Guidelines Disconnected Normal state of module between calls or data connections • • • Host keeps module powered off by driving W_DISABLE_N low • Host power source is disconnected from the module and all voltages associated with the module are at 0 V.
Power 1. Module-reported temperatures at the printed circuit board. 2. Supply voltage — 3.
Product Technical Specification & Customer Design Guidelines Note: Startup time is the time after power-up when the modem is ready to begin the enumeration sequence. Transmit power waveform (GSM) As shown in Figure 6-3, at maximum GSM transmit power, the input current can remain at 2.4 A for up to 25% of each 4.6 ms GSM cycle (1.15 ms) after reaching an initial peak of 2.75 A (average over 100 µs, with an instantaneous peak current of 3.5 A). For class 12 operation, the peak could remain for 2.
7 7: Software Interface Support tools The MC7710 is compatible with the following support tools from Sierra Wireless and authorized third parties: • Firmware update utilities from Sierra Wireless • QXDM from QUALCOMM • QUALCOMM Product Support Tool (QPST) • Windows and Linux SDKs (including API and drivers) USB interface The device supports two USB interface types — the Sierra Wireless Direct IP high speed interface supported by previous generation minicard devices, and the Qualcomm QMI interface.
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8: Mechanical and Environmental Specifi- 8 cations The MC7710 module complies with the mechanical and environmental specifications in Table 8-1. Final product conformance to these specifications depends on the OEM device implementation.
Product Technical Specification & Customer Design Guidelines Device views Top view Top view Bottom view Bottom view Figure 8-1: Top and bottom views Figure 8-2: Dimensioned view 58 Proprietary and Confidential - Contents subject to change 2400089
Mechanical and Environmental Specifications Labeling MC77XX IMEI # 352678011234569 FPPDDDYNNNNHH BB ||||||||||||||||||||||||||||||||||| FCC ID: N7Nxxxxxx PRODUCT OF CHINA Figure 8-3: Unit label Note: The displayed label is an example only. The production label will vary by SKU.
Product Technical Specification & Customer Design Guidelines Thermal considerations Embedded modules can generate significant amounts of heat that must be dissipated in the host device for safety and performance reasons. Transmitter Receiver Baseband 1 Baseband 2 Pin 1 Pin 1 Top Bottom Figure 8-4: Shield locations The amount of thermal dissipation required depends on: • Supply voltage — Maximum power dissipation for the module can be up to 3.1 W (or 3.5 W in HSPA+ mode) at voltage supply limits.
Mechanical and Environmental Specifications Module integration testing When testing your integration design: • Test to your worst case operating environment conditions (temperature and voltage) • Test using worst case operation (transmitter on 100% duty cycle, maximum power) • Monitor temperature at all shield locations. Attach thermocouples to the areas indicated in Figure 8-4 on page 60 (Transmitter, Baseband 1, Receiver, Baseband 2).
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9 9: Regulatory and Industry Approvals This module is designed to and, upon commercial release, will be certified to meet regulatory requirements (e.g. CE). Upon commercial release, the following regulatory approvals will have been attained: • CE Upon commercial release, the following industry approvals will have been obtained: • GCF-CC Additional approvals may be obtained upon customer request — contact your Sierra Wireless account representative for details.
Product Technical Specification & Customer Design Guidelines In an aircraft, the MC7710 modem MUST BE POWERED OFF. Otherwise, the MC7710 modem can transmit signals that could interfere with various onboard systems and may be dangerous to the operation of the aircraft or disrupt the cellular network. Use of a cellular phone in an aircraft is illegal in some jurisdictions.
A A: Antenna Specification This appendix describes recommended electrical performance criteria for main path, diversity path, and GPS antennas used with AirPrime embedded modules. The performance specifications described in this section are valid while antennas are mounted in the host device with antenna feed cables routed in their final application configuration. Note: Antennas should be designed before the industrial design is finished to make sure that the best antennas can be developed.
Product Technical Specification & Customer Design Guidelines Table A-1: Antenna requirements (Continued) a Parameter Requirements Envelope correlation coefficient between Ant1 and Ant2 Comments < 0.4 on 730–960 MHz band < 0.3 on 1800–1990 MHz and 2110–2170 MHz bands < 0.
Antenna Specification Recommended GPS antenna specifications Table A-2: GPS standalone antenna requirements Parameter Frequency range Field of view (FOV) Requirements • 1575.42 MHz ±2 MHz minimum • 1565–1606 MHz recommended • Omni-directional in azimuth • -45° to +90° in elevation Comments Polarization (average Gv/Gh) > 0 dB Vertical linear polarization is sufficient.
Product Technical Specification & Customer Design Guidelines • Any metallic part of the antenna system that is exposed to the outside environment needs to meet the electrostatic discharge tests per IEC61000-42 (conducted discharge +8kV). • The functional requirements of the antenna system are tested and verified while the embedded module’s antenna is integrated in the host device.
B B: Design Checklist This chapter provides a summary of the design considerations mentioned throughout this guide. This includes items relating to the power interface, RF integration, thermal considerations, cabling issues, and so on. Note: This is NOT an exhaustive list of design considerations. It is expected that you will employ good design practices and engineering principles in your integration.
Product Technical Specification & Customer Design Guidelines Table B-1: Hardware integration design considerations (Continued) Suggestion Section where discussed SIM implementation on Provide ESD protection for the SIM connector at the exposed contact point (in particular, the CLK, VCC, IO, and RESET lines). page 34 Keep very low capacitance traces on the USIM_DATA and USIM_CLK signals.
C C: Testing Note: All AirPrime embedded modules are factory-tested to ensure they conform to published product specifications. Developers of OEM devices integrating Sierra Wireless AirPrime embedded modules should include a series of test phases in their manufacturing process to make sure that their devices work properly with the embedded modules.
Product Technical Specification & Customer Design Guidelines Acceptance test requirements To perform the suggested tests, you require a test system in which to temporarily install the module, and you must be able to observe the test device’s LED indicator. Acceptance test procedure The following is a suggested acceptance testing procedure using Sierra Wireless’ Watcher™ software: Note: You can perform these tests using appropriate AT commands. Test 1: Check power-up and initialization 1.
Testing • Factory Mutual (FM Global — www.allendale.com) • Underwriters Laboratories Inc. (www.ul.com) • CDG (CDMA Development Group — www.cdg.org) • GCF (Global Certification Forum — www.globalcertificationforum.org) outside of North America • PTCRB (PCS Type Certification Review Board — www.ptcrb.com) in North America Production testing Note: Production testing typically continues for the life of the product.
Product Technical Specification & Customer Design Guidelines Suggested production tests Consider the following tests when you design your production test procedures for devices with the AirPrime module installed.
Testing · With one other USB device already connected and assigned to ttyUSB1: (Note: The AT port is the fourth new device — / dev / ttyUSB4.) 6. Make sure your modem is connected and running, and then establish contact with the module: · Windows systems: Use a terminal emulation / communications program such as Microsoft HyperTerminal® to connect over the COM port reserved for AT commands (see listings in Step 5): a. Start HyperTerminal. b. Select File > Connection Description.
Product Technical Specification & Customer Design Guidelines 7. Display the firmware version: · AT!GVER 8. Test the LED — Set the LED in blinking mode using this command, then visually verify that the LED turns off and on: · AT!LEDCTRL 9. Unlock the extended AT command set: · AT!ENTERCND 10. Put the module in diagnostic / factory test mode: · AT!DAFTMACT 11. Communicate with the SIM using +CPIN or +CIMI. When performing RF tests, use a test platform as described in Suggested testing equipment on page 83.
Testing 7. Press Enter twice. 8. Use the down-arrow key to select Save setup as dfl. 9. Select Exit. UMTS RF transmission path test Note: This procedure segment is performed in Step 12 of the Production test procedure on page 74. Table C-1 contains parameters used in the suggested test procedure that follows.
Product Technical Specification & Customer Design Guidelines d. AT!DASCHAN= (Set modem channel) · See Table C-1 for appropriate values e. (GSM mode only) AT!DAGSTXFRAME=0, 1, 3000, 0 f. AT!DASTXON (Set Tx frame structure.) (Turns on the transmit path.) g. (WCDMA mode only) AT!DAWSTXCW=0 AT!DASPDM=2, 75 (Use a modulated carrier.) (Set the power level. Repeat command with different offsets until desired Tx power is obtained.) AT!DAWSPARANGE=3 (Set to high PA gain state.) h.
Testing UMTS RF receive path test Note: This procedure segment is performed in Step 13 of the Production test procedure on page 74. Table C-2 contains parameters used in the suggested test procedure that follows. Table C-2: Test settings — Receive path Bands Mode WCDMA Test category 850 900 1800 1900 2100 Frequencya (MHz) 882.60 948.60 n/a 1961.2 2141.2 Band 22 29 n/a 15b 9 Channelc 4182 2812 n/a 9400 9750 n/a 948.067 1842.267 1960.
Product Technical Specification & Customer Design Guidelines 2. Set up the DUT: a. AT!ENTERCND (Unlock extended AT command set.) b. AT!DAFTMACT (Put modem into factory test mode.) c. AT!DASBAND= (Set frequency band.) · See Table C-2 on page 79 for values d. AT!DASCHAN= (Set modem channel) · See Table C-2 on page 79 for values e. AT!DASLNAGAIN=0 (Set the LNA to maximum gain.) f. (WCDMA mode) i. AT!DAWGAVGAGC=9400,0 (For PCS1900, channel 9400 as an example.) (GSM mode) ii.
Testing LTE RF receive path test Note: This procedure segment is performed in Step 13 of the Production test procedure on page 74. Table C-3 contains parameters used in the suggested test procedure that follows. Table C-3: Test settings — Receive path Bands Mode LTE Test category B13 B17 B4 Frequencya (MHz) 753.0 742.0 2134.5 Band 36 37 42 Channelb 23230 23790 20175 a. All values offset from actual center channel by +2 MHz b.
Product Technical Specification & Customer Design Guidelines d. AT!DASCHAN= (Set modem channel) · See Table C-3 on page 81 for values e. AT!DALGAVGAGC=,0 (Get averaged Rx AGC) · See Table C-3 on page 81 for values 3. Test limits — Run ten or more good DUTs through this test procedure to obtain a nominal received power value. · Apply a tolerance of 5 to 6 dB to each measurement (assuming a good setup design).
Testing 5. (Optional) Turn the signal generator on again, and reduce the level to 120dBm. Take more !DACGPSCTON readings and use these as a reference for what a marginal / poor signal would be. Note: The response to AT!DACGPSCTON for a good connection should show CtoN within 58 +/- 5dB (preliminary value) and Freq (frequency offset) within 100000 Hz +/- 5000 Hz . Quality assurance testing Note: QA is an ongoing process based on random samples from a finished batch of devices.
Product Technical Specification & Customer Design Guidelines Sierra Wireless offers optional professional services based assistance to OEMs with regulatory approvals. IOT/Operator testing Interoperability and Operator/Carrier testing of the finished system is the responsibility of the OEM. The test process will be determined with the chosen network operator(s) and will be dependent upon your business relationship with them, as well as the product's application and sales channel strategy.
Testing Table C-4: Extended AT commands (Continued) Command Rev 6 Mar.
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D D: Packaging Sierra Wireless AirPrime Mini Cards are shipped in sealed boxes. The standard packaging (see Figure 4-1), contains a single tray with a capacity of 100 modules . (Note that some SKUs may have custom packaging — contact Sierra Wireless for SKU-specific details.) In the standard packaging, Mini Cards are inserted, system connector first, into the bottom portion (T1) of a two-part tray. all facing the same direction.
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E E: References This guide deals specifically with hardware integration issues that are unique to AirPrime embedded modules. Web site support For additional documents describing embedded module design, usage, and integration issues (AT command references, integration guides, etc.), visit developer.sierrawireless.com. Sierra Wireless documents The following Sierra Wireless documents are available from developer.sierrawireless.com.
Product Technical Specification & Customer Design Guidelines [12] JESD22-A114-B [13] JESD22-C101 90 Proprietary and Confidential - Contents subject to change 2400089
F F: Acronyms Table F-1: Acronyms and definitions Acronym or term Definition 3GPP 3rd Generation Partnership Project 8PSK Octagonal Phase Shift Keying AGC Automatic Gain Control A-GPS Assisted GPS API Application Programming Interface BER Bit Error Rate — A measure of receive sensitivity BLER Block Error Rate bluetooth Wireless protocol for data exchange over short distances CDG CDMA Development Group—a consortium of companies that develop and promote the products and services for CDMA w
Product Technical Specification & Customer Design Guidelines Table F-1: Acronyms and definitions (Continued) Acronym or term 92 Definition DSM Distributed Shared Memory DUT Device Under Test EDGE Enhanced Data rates for GSM Evolution EIRP Effective (or Equivalent) Isotropic Radiated Power EMC Electromagnetic Compatibility EMI Electromagnetic Interference ERP Effective Radiated Power ESD Electrostatic Discharge FCC Federal Communications Commission The U.S.
Acronyms Table F-1: Acronyms and definitions (Continued) Acronym or term Rev 6 Mar.13 Definition Hz Hertz = 1 cycle / second IC Industry Canada IF Intermediate Frequency IMEI International Mobile Equipment Identity inrush current Peak current drawn when a device is connected or powered on inter-RAT Radio Access Technology IOT Interoperability Testing IS Interim Standard. After receiving industry consensus, the TIA forwards the standard to ANSI for approval.
Product Technical Specification & Customer Design Guidelines Table F-1: Acronyms and definitions (Continued) Acronym or term 94 Definition PA Power Amplifier packet A short, fixed-length block of data, including a header, that is transmitted as a unit in a communications network. PCB Printed Circuit Board PCS Personal Communication System A cellular communication infrastructure that uses the 1.9 GHz radio spectrum.
Acronyms Table F-1: Acronyms and definitions (Continued) Acronym or term Rev 6 Mar.13 Definition SISO Single Input Single Output—antenna technology that uses a single antenna at both the transmitter side and the receiver side. SKU Stock Keeping Unit—identifies an inventory item: a unique code, consisting of numbers or letters and numbers, assigned to a product by a retailer for purposes of identification and inventory control. SMS Short Message Service.
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Index Numerics 3D gain, average gain 3D average (GPS), 67 3GPP compliance GSM / GPRS / EDGE, 23 LTE, 23 UMTS, 23 A acceptance tests, 71 accessories, 17 accuracy (GPS), 47 acquisition time (GPS), 47 acronyms and definitions, 91– 96 A-GPS, 17 antenna connection considerations, 39 connectors, 25 custom, design, 40 diversity antenna, disabling, 40 GPS, specifications, recommended, 67 limit, matching coaxial connections, 39 location, considerations, 40 matching, considerations, 40 maximum cable loss, 39 routing
Product Technical Specification & Customer Design Guidelines E EDGE overview, 22 bands supported, 15 connector, required, 18 power classes, 22 electrical specifications, 25 electrostatic discharge specifications, 57 electrostatic discharge.
Index LED example, 37 states, 37 LED output, 25, 35, 37 LTE 3GPP compliance, 23 overview, 21 bands supported, 15 bandwidth support, 44 features, 16 frequency band support, 44 M mean effective gain, 66 mean effective gain imbalance, 66 mechanical specifications, 57– 59 MIB, 16 MIMO support, 15 minicom downloading and installing, 76 module power states, 51– 53 N NAS/AS security, 16 NDIS NIC interface support, 16 NIC interface support, 16 noise leakage, minimizing, 41 RF interference, power supply, 54 O OE
Product Technical Specification & Customer Design Guidelines RF bands supported summary, 15 GSM, 45 LTE, 44 WCDMA, 44 RF block diagram, expanded, 27 RF connector location, 39 RF specifications, 39– 47 RI, 16 RSE, 42 Rx sensitivity conducted, 45 SSS, 16 standalone mode, GPS, 17 standby DC power consumption, averaged, 49 state machines, 52 support features, 17 testing assistance by Sierra Wireless, 83 tools, 55 system acquisition, 16 system block diagram, 26 S temperature specifications, 57 temperature, m
Index V vibration specifications, 57 VSWR, 65, 67 W W_DISABLE_N, 35, 36 WAKE_N, 25, 35 warranty, 17 Rev 6 Mar.
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