Hardware Integration Guide AirPrime AR7582 4111xxxx 0.
Hardware Integration Guide Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Hardware Integration Guide Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc. or its affiliates under one or more patents licensed from InterDigital Group and MMP Portfolio Licensing. Copyright © 2016 Sierra Wireless. All rights reserved.
Hardware Integration Guide Document History Version Date Updates 0.1 May 12, 20167 Creation 41110461XXXX Rev 0.
Contents 1. INTRODUCTION .................................................................................................. 9 1.1. General Features .............................................................................................................. 9 1.2. Power ................................................................................................................................ 9 1.3. RF ................................................................................................
Hardware Integration Guide 7. ABBREVIATIONS .............................................................................................. 30 41110461XXXX Rev 0.
List of Figures Figure 1. AppCAD Screenshot for Microstrip Design Power Mode Diagram ................................. 21 Figure 2. RF Routing Examples ..................................................................................................... 22 Figure 3. Coplanar Clearance Example ......................................................................................... 22 Figure 4. Antenna Microstrip Routing Example .........................................................................
List of Tables Table 1. AirPrime AR758x Series Embedded Modules .................................................................. 9 Table 2. AirPrime AR758x Series Supported Carrier Aggregation Combinations1 ......................... 9 Table 3. Power Supply Requirements ............................................................................................. 9 Table 4. Power Supply Pads ...........................................................................................................
1. Introduction 1.1. General Features The AirPrime AR7582 embedded modules are designed for the automotive industry. It support LTE, WCDMA and GSM air interface standards. It also have Global Navigation Satellite System (GNSS) capabilities including GPS, GLONASS, Galileo, BeiDou, and QZSS The AirPrime AR7582 embedded modules are based on the Qualcomm MDM9628 wireless chipset and support the following bands. Table 1.
Hardware Integration Guide 1.3.1. Introduction GSM RF Interface This section presents the GSM RF Specification for the AirPrime AR7582. 1.3.1.1. GSM TX Output Power The GSM Maximum Transmitter Output Power of the AirPrime AR7582 are specified in the following table. Note: Table 4. All values presented in the table below are preliminary.
Hardware Integration Guide 1.3.2. Introduction WCDMA RF Interface This section presents the WCDMA RF Specification for the AirPrime AR758x Series. 1.3.2.1. WCDMA TX Output Power The WCDMA Maximum Transmitter Output Power of the AirPrime AR758x Series is specified in the following table. Note: Table 6. All values presented in the table below are preliminary. Conducted TX (Transmit) Max output Power Tolerances – WCDMA Bands Band 1 Limit (dBm) 2 Room (dBm) Class A (Extreme) (dBm) 3 B2 24 +1.7/-3.
Hardware Integration Guide Introduction 1 CS 0.1% BER 12.2 kbps 2 Test at Class A extreme condition 1.3.3. LTE RF Interface This section presents the LTE RF Specification for the AirPrime AR758x Series. 1.3.3.1. LTE TX Output Power The LTE Maximum Transmitter Output Power of the AirPrime AR758x Series are specified in the following table. Note: The test configuration for all of the entries in the table below is per 3GPP specification, Connectorized (Class 3).
Hardware Integration Guide Table 10. Introduction Conducted RX Sensitivity 3GPP (BW: 10MHz) – LTE Bands1, 4 Band Standard (dBm) 2 Room Typical (dBm) Class A (Extreme) Typical (dBm) 5 Class A Limit (dBm) 5 B2 -94.3 -101 -100 -95 B4 -96.3 -101 -100 -97 B5 -94.3 -102.5 -101.5 -95 B7 -94.3 -99.5 -98 -95 B12 -93.3 -102.5 -101.5 -94 B13 -93.3 -102.5 -101 -94 B17 -93.3 -102.5 -101 -94 1: Dual receiver (SIMO) per 3GPP TS 36.
Hardware Integration Guide Introduction Pad Name BA13 GND Primary Antenna Ground BB11 GND Primary Antenna Ground BB12 GND Primary Antenna Ground BA7 GND Diversity Antenna Ground BA8 DIVERSITY_ANT BA9 GND Diversity Antenna Ground BB7 GND Diversity Antenna Ground BB8 GND Diversity Antenna Ground 1.3.4.1. Direction Input Function Diversity Antenna Interface WWAN Antenna Recommendations The table below defines the key characteristics to consider for antenna selection. Table 13.
Hardware Integration Guide Parameter Introduction Requirements Comments If antennas can be moved, test all Isolation between Ant1 and Ant2 (S21) > 10 dB positions for both antennas. Unless otherwise specified, this isolation requirement need to be maintained for optimum operation. Make sure all other wireless devices (Bluetooth or WLAN antennas, etc.) are turned OFF to avoid interference.
Hardware Integration Guide Introduction Parameter/Feature Value QZSS L1 Satellite channels Tracking 40 Acquisition 118 Standalone Time To First Fix (TTFF) Hot start: 1s Warm start 27 s Cold start 29 s Tracking 4,5,6 -163 dBm Cold start Acquisition -158 dBm Hot start Acquisition -145 dBm 1,2,4,6 Sensitivity (GPS, GLONASS, BeiDou) Horizontal Position accuracy 1,3,4,5,6, 2 / 57 Altitude accuracy 1,3,4,5,6, 4 / 107 Velocity accuracy 1,3,4,5,6 0.
Hardware Integration Guide Introduction Pad Name BA6 GND GNSS Antenna Ground BB4 GND GNSS Antenna Ground BB5 GND GNSS Antenna Ground 1.4.2.1. Direction Function GNSS Antenna Recommendations To be added in a future revision. 1.5. Electrical Specifications This section provides details of the key electrical specifications of the AirPrime AR758x Series. 1.5.1. Absolute Maximum Ratings This section defines the Absolute Maximum Ratings of the AirPrime AR758x Series. Warning: Table 16.
Hardware Integration Guide Introduction Parameter Comments Min Typ Max Units VIL Low level input voltage CMOS/Schmitt -0.3 – 0.42 V IIH Input high leakage current No pull-down – – 2 µA IIL Input low leakage current No pull-up -2 – – µA VOH High-level output voltage CMOS, at rated drive strength 0.9 – 1.25 V VOL Low level output current CMOS, at rated drive strength 0 – 0.
Hardware Integration Guide Introduction AirPrime AR758x/AR8582 device which could potentially damage the device or result in GPIOs being set to undetermined levels. Table 19. Digital IO Characteristics for SDIO1 VDD=1.8V Nominal Parameter Comments Min Typ Max Units VIH High level input voltage CMOS/Schmitt 1.27 – 2 V VIL Low level input voltage CMOS/Schmitt -0.3 – 0.
2. Audio Specification 2.1. Digital Audio The AirPrime AR758x Series provides two 4-wire digital audio interfaces. Each interface can be configured as either a PCM or an I2S interface. Table 21.
3. Routing Constraints and Recommendations Layout and routing of the AirPrime AR758x Series in the application is critical to maintaining the performance of the radio. The following sections provide guidance to the developer when designing their application to include an AirPrime AR758x Series and achieve optimal system performance. 3.1.
Hardware Integration Guide Routing Constraints and Recommendations Poor routing Correct routing The yellow traces cross the RF trace. There is no signal around the RF path. Figure 2. RF Routing Examples Fill the area around the RF traces with ground and ground vias to connect inner ground layers for isolation. Cut out ground fill under RF signal pads to reduce stray capacitance losses. Avoid routing RF traces with sharp corners. A smooth radius is recommended. E.g.
Hardware Integration Guide Routing Constraints and Recommendations RF Connector GND GND 50 Ohm Controlled Impedance Trace GND GND GND GND GND AR759x ANT GND GND GND Figure 4. 2x Ground holdback – twice the trace width Antenna Microstrip Routing Example 3.2.
Hardware Integration Guide 3.4. Routing Constraints and Recommendations Antenna Recommendations Connecting the antenna ground reference to the vehicle chassis is not recommended since that has been known to cause noise from the engine to couple into the audio of the device. It is ultimately up to the integrator to evaluate this performance. 3.5. Interface Circuit Recommendations The recommended interface implementation is to use a dual-supply bus transceiver with configurable voltage translation.
4. Firmware and Tools The AirPrime AR7582 are designed based on Qualcomm’s MDM9628 chipset, which contains a Modem Processor for running modem firmware components and an Application Processor for running embedded Linux applications. Various tools are provided by Qualcomm and developed by Sierra Wireless for developing and commercializing the AirPrime AR7582. 4.1.
5. Approval 5.1. Important Notice Because of the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Hardware Integration Guide Approval 4.0 dBi in LTE Band 13 4.0 dBi in LTE Band 17 3. The AR7582 modem may transmit simultaneously with other collocated radio transmitters within a host device, provided the following conditions are met: Each collocated radio transmitter has been certfied by FCC / IC for mobile application. At least 20 cm separation distance between the antennas of the collocated transmitters and the user’s body must be maintained at all times.
Hardware Integration Guide Approval Note: If this module is intended for use in a portable device, you are responsible for separate approval to satisfy the SAR requirements of FCC Part 2.1093 and IC RSS-102. 5.4. IC Regulations This device complies with Industry Canada’s license-exempt RSSs. Operation is subject to the following two conditions: 1. This device may not cause interference; and 2.
6. References The table below lists the reference specifications for this product. Table 22. Ref Reference Specifications Title Rev Issuer [1] 3GPP TS 51.010-1 Version 7.3.1 3GPP [2] 3GPP TS 34.121-1 V8 3GPP [3] 3GPP TS 36.521-1 V9 3GPP [4] Universal Serial Bus Specification V2.0 USB Implementers Forum [5] Universal Serial Bus CDC Subclass Specification for Wireless Mobile Communication Devices V1.
7. Abbreviations The table below lists several abbreviations used in this document. Table 23.
