Prroduc ct Tec chnic cal Sp pecific catio on AirPri A ime A AR7550 4114188 0.
Product Technical Specification Important Notice Due to the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Product Technical Specification SPECIFIC DISCLAIMERS OF LIABILITY: CUSTOMER RECOGNIZES AND ACKNOWLEDGES SIERRA WIRELESS IS NOT RESPONSIBLE FOR AND SHALL NOT BE HELD LIABLE FOR ANY DEFECT OR DEFICIENCY OF ANY KIND OF CELLULAR OR GPS (INCLUDING A-GPS) SERVICES. Patents This product may contain technology developed by or for Sierra Wireless Inc. This product includes technology licensed from QUALCOMM®. This product is manufactured or sold by Sierra Wireless Inc.
Product Technical Specification Document History Version Date Updates 0.1 March 29, 2013 Creation based on document 4112476: AirePrime – AR755x Series – Product Technical Specification – Rev0.4. 41124764188 Rev 0.
Contents 1. INTRODUCTION ................................................................................................ 11 1.1. General Features ............................................................................................................11 2. FUNCTIONAL SPECIFICATIONS...................................................................... 12 2.1. Modes of Operation .........................................................................................................12 2.2.
Product Technical Specification 6. BASEBAND SPECIFICATION ........................................................................... 32 6.1. Power Supply ..................................................................................................................32 6.1.1. Under-Voltage Lockout (UVLO) ...............................................................................32 6.2. VCOIN ...........................................................................................................
Product Technical Specification 8. REGULATORY INFORMATION......................................................................... 58 8.1. Important Notice ..............................................................................................................58 8.2. Important Compliance Information for USA OEM Integrators .........................................58 9. REFERENCES ................................................................................................... 60 10.
List of Figures Figure 1. AirPrime AR7550 Block Diagram .................................................................................... 13 Figure 2. AR55x Assembly Drawing ............................................................................................... 16 Figure 3. AirPrime AR7550 Mechanical Dimensions Drawing ....................................................... 16 Figure 4. AirPrime AR7550 Footprint ..............................................................................
List of Tables Table 1. AirPrime AR7550 Embedded Modules ........................................................................... 11 Table 2. AirPrime AR7550 Modes of Operation ............................................................................ 12 Table 3. Communications Functions ............................................................................................. 12 Table 4. AirPrime AR7550 Environmental Specifications ............................................................
Product Technical Specification Table 38. Period of Wake Intervals ................................................................................................. 36 Table 39. Deep Sleep Function Availability ..................................................................................... 36 Table 40. USB Pad Details .............................................................................................................. 37 Table 41. USB Characteristics ...................................
1. Introduction 1.1. General Features The AirPrime AR7550 embedded modules are designed for the automotive industry. They support LTE, CDMA, WCDMA air interface standards and shares hardware and firmware interfaces with the AirPrime AR5550 and AR855x. They also have Global Navigation Satellite System (GNSS) capabilities including GPS and GLONASS. The AirPrime AR7550 embedded modules are based on the Qualcomm MDM9615 wireless chipset and support the following bands. Table 1.
2. Functional Specifications This chapter highlights the features of the AirPrime AR7550 series of embedded modules. 2.1. Modes of Operation The AirPrime AR7550 supports 2G/3G/4G operations and also supports GNSS operation. For complete details, refer to the table below. Table 2.
Product Technical Specification 2.3. Figure 1. 41124764188 Block Diagrams AirPrime AR7550 Block Diagram Rev 0.
3. Hardware Specifications 3.1. Environmental Specifications The environmental specification for both operating and storage of the AirPrime AR7550 embedded modules are defined in the table below. Table 4.
Product Technical Specification Parameter Min Max Units Maximum Voltage applied to antenna interface pins VANT Primary Antenna - 36 V RX2 Antenna - 36 V GNSS Antenna - 36 V Primary, RX2 and GNSS antenna pads - Contact - ±8 kV All other signal pads - Contact - ± 1.5 kV ESD Ratings ESD1 1 The ESD Simulator configured with 330pF, 1000Ω. Caution: The AirPrime AR7550 embedded modules are sensitive to Electrostatic Discharge.
Product Technical Specification 3.3.2. Mechanical Drawing Figure 2. AR55x Assembly Drawing Figure 3. AirPrime AR7550 Mechanical Dimensions Drawing Note: 41124764188 The dimensions in Error! Reference source not found. are preliminary and subject to change. Rev 0.
Product Technical Specification 3.3.3. Footprint The AirPrime AR7550 device LGA footprint is a 303 pad array of 0.9mm, 1.45mm, and 1.90mm pads. The following drawing illustrates the device footprint. The application footprint is recommended to mirror the device footprint as illustrated in the following drawing (subject to change). Figure 4. AirPrime AR7550 Footprint Figure 5. AirPrime AR7550 Recommended Application Land Pattern 41124764188 Rev 0.
Product Technical Specification 3.3.4. Thermal Consideration The AirPrime AR7550 device is designed to work over an extended temperature range. In order to do this efficiently a method of sinking heat from the product is recommended. Refer to application notes (TBD) for details. Figure 6. 41124764188 AirPrime AR7550 Heatsink Contact Area Rev 0.
4. RF Specification This section presents the WWAN RF interface of the AirPrime AR7550 series of embedded modules. The specifications for the LTE, CDMA and WCDMA interfaces are defined. 4.1. LTE RF Interface This section presents the LTE RF Specification for the AirPrime AR7550. 4.1.1. LTE Max TX Output Power The Maximum Transmitter Output Power of the AirPrime AR7550 embedded modules are specified in the following table. Table 7.
Product Technical Specification Band Frequency Band Band 13 776 MHz to 787 MHz 4.1.2. Nomi nal Max TX Outp ut Powe r Tolera nce LTE RX Sensitivity The Minimum Receiver Sensitivity of the AirPrime AR7550 embedded modules are specified in the following table. Table 8. AirPrime AR7550 Minimum LTE Receiver Sensitivity Band Frequency Band Minimum RX Downlink Criteria Band 4 1710 MHz to 1755 MHz tbd tbd Band 7 2500 MHz to 2570 MHz tbd tbd Band 13 746 MHz to 757 MHz tbd tbd 4.2.
Product Technical Specification Table 9. AirPrime AR7550 Maximum CDMA Transmitter Output Power Band Class Frequency Band BC0 800 MHz BC1 1900 MHz 4.2.2. Nominal Max TX Output Power Tolerance +24 dBm +1.5/-1 dB (Class A) +1.5/-2 dB (Class B) CDMA RX Sensitivity The Minimum Receiver Sensitivity of the AirPrime AR7550 embedded module is specified in the following table. Table 10.
Product Technical Specification 4.4. WWAN Antenna Interface The specification for the WWAN Antenna Interface of the AirPrime AR7550 embedded modules are defined in the table below. Table 13.
Product Technical Specification 4.5. Primary Antenna Diagnostics The primary antenna diagnostic feature allows the AirPrime AR7550 embedded module to determine if the primary antenna connected to the module is: open, shorted or normal. The antenna connected to this interface needs to have a DC resistance to ground of 10 kΩ ± 1k embedded inside. The ARx55x FW accepts two limits which are used to evaluate the status of the antenna, representing the short and open thresholds.
Product Technical Specification The following example illustrates the Antenna states and resistance values for a typical limit setting. AT+ANTLIMT=2,839,1088 Table 19. RX2 Antenna Diagnostics Ranges Antenna State Min ADC Max ADC Antenna Resistance Range Short 0 839 ~ ≤ 7 kΩ Normal 841 1086 7 kΩ < x < 13 kΩ Open 1088 1900 ≥ 13 kΩ Note: 41124764188 Highlighted numbers in the table above are programmed as shortLim and openLim using the +ANTLIMT command. Rev 0.
5. GNSS Specification The AirPrime AR7550 embedded module includes optional Global Navigation Satellite System (GNSS) capabilities via the Qualcomm gpsOne Gen8 Engine, capable of operation in assisted and stand-alone GPS modes as well as GPS+GLONASS mode. 5.1. GNSS The GNSS implementation supports GPS L1 operation and GLONASS L1 FDMA operation. Table 20.
Product Technical Specification Minimum isolation between the GNSS and WWAN Antenna must be 10 dB for the AirPrime AR7550. Table 22. GNSS Antenna Interface Pads Pad Name BA4 GND BA5 GNSS_ANT BA6 GND 5.2.1. Direction Function GNSS Antenna Ground Input GNSS Antenna Interface GNSS Antenna Ground GNSS Antenna Recommendations The table below defines the key characteristics to consider for antenna selection. Table 23.
Product Technical Specification The following table identifies some key VGNSS_ANT current draw values and the associated ADC values. Table 25. VGNSS_ANT Current Draw I (mA) Nominal 0 337 5 612 10 936 15 1242 20 1558 25 1877 30 2194 35 2494 40 2821 45 3188 50 3444 55 3747 60 4065 65 4292 70 4319 The graph below illustrates the relationship between current drawn on VGNSS_ANT vs the ADC readings used to monitor the GNSS Antenna status. 41124764188 Rev 0.
Product Technical Specification Figure 7. VGNSS_ANT vs. ADC Readings Relationship PMIC GNSS_ANT_ADC MPP_02 10K 200V/V Converter Vout 0~4.35V S+ 150K S‐ BOOST REG LGA VBATT VIN VOUT I Lim 5V VGNSS 330m VIN VOUT 5V FB BOOST_CTRL ON PM8018 ILIM_OC_N GPIO_09 MDM9X15 GPIO_69 Figure 8. 41124764188 Current Limit=75mA GNSSPWR_EN GPIO_59 FLAGB ILIM_EN GNSS Power Supply and Antenna Diagnostics Block Diagram Rev 0.
Product Technical Specification 5.4. Current Consumption The table below summarizes some key current consumption values for various modes of the AirPrime AR7550 devices. Table 26.
Product Technical Specification Parameter Comments Min Typ Max Units VIL Low level input voltage CMOS/Schmitt -0.3 – 0.35* VCC_1V8 V VOH High level output voltage CMOS, at pin rated drive strength VCC_1V8 - 0.45 – VCC_1V8 V VOL Low-level output voltage CMOS, at pin rated drive strength 0 – 0.45 V IOH High level output current VOH = VCC_1V8 – 0.45 V – – 6 mA IOL Low Level output current VOL = 0.
Product Technical Specification Subsystem/Feature Frequency Units Fundamental clock, codec, TCXO_OUT 19.2 MHz PLL tbd MHz USB 12, 480 Mb/s 41124764188 Rev 0.
6. Baseband Specification 6.1. Power Supply The AirPrime AR7550 embedded module is powered via a single regulated DC power supply, 3.7V nominal. The power supply requirements can be found in the following table. Table 29. Power Supply Requirements Power Supply Min Typ Max Units Main DC Power Input Range 3.4 3.7 4.2 V 0 to 1kHz - - 200 mVpp >1kHz - - 50 mVpp AR7550 - - tbd mA Power Supply Ripple Maximum Current draw AirPrime AR7550 does not support USB bus-powered operation.
Product Technical Specification Note: If the AirPrime AR7550 device has 6 UVLO events without a valid power down or reset sequence, it enters a mode in which only the DM port enumerates on the USB. Table 31. UVLO Thresholds UVLO 6.2. Description Value Units Rising threshold 2.725 V Falling threshold 2.55 V Minimum Duration below Falling threshold 1.
Product Technical Specification 6.3. ON/OFF Control The AirPrime AR7550 provides an interface for controlling the device ON/OFF state. Table 35. ON/OFF Control Pads Pad Name Direction Function If Unused BB1 ON/OFF Input ON/OFF Control Must Be Used The ON/OFF signal is internally pulled up to an internal 1.8V reference voltage. An open drain transistor should be connected to this pin to generate a low pulse. This pin should not be driven high external to the AirPrime AR7550 embedded module.
Product Technical Specification Figure 11. Alternate ON/OFF Control Table 37. Power-ON Sequence Symbol Definitions Symbol Parameter tON Boot Min Typ Max Turn ON Pulse duration 50 ms 100 ms ∞ tOFF Turn OFF Pulse duration 50 ms 100 ms 500 ms tpwroff Time to Power OFF - 5s - tpwrrmv Time VBATT must be maintained after VCC_1V8 goes inactive 0s - - tHI Time required for ON/OFF to be high prior to OFF pulse.
Product Technical Specification 6.3.3. Software-Initiated Power Down The host application may choose to use the AT Command AT!POWERDOWN to initiate a power down of the AirPrime AR7550 device instead of using an OFF pulse. In this scenario the ON/OFF signal should be left open by the application. The AirPrime AR7550 device will initiate a power up after completion of the power down if ON/OFF is low. 6.3.4.
Product Technical Specification Function Availability Conditions GNSS - GNSS is powered down Time measurement USB - UART - Digital IO - USB_VBUS is not applied Digital IO pins maintained last state Events that cause the AirPrime AR7550 to wake-up from Deep Sleep mode include: Incoming call Expiration of an internal timer in the AirPrime AR7550 USB_VBUS is applied to the AirPrime AR7550 WAKE_N is asserted (low) UART1 DTR is asserted (high) if UART1 DTR has been enabled as
Product Technical Specification Table 41. USB Characteristics USB Value Units 2.0 – 5.25 V Maximum Current draw 1 mA Maximum Input Capacitance (Min ESR = 50 mΩ) 10 μF Voltage range 1 USB_VBUS 1 With the AirPrime AR7550 device powered ON. 6.5. UART The AirPrime AR7550 has two UART interfaces. The primary UART is an 8-wire1 electrical interface and the secondary UART is a 2-wire electrical interface. Table 42.
Product Technical Specification 6.7. UIM Interface The UIM interface of the AirPrime AR7550 supports a USIM/CSIM for LTE, WCDMA, GSM and CDMA. The UIM can be embedded internally in AR7550 and can be external to AR7550. Table 44.
Product Technical Specification 6.8. General Purpose IO The AirPrime AR7550 defines 10 GPIOs for customer use. Table 45.
Product Technical Specification 6.10. I2C The AirPrime AR7550 provides an I2C interface. Table 48. I2C Interface Pads Pad Name Direction Function If Unused CD6 I2C_CLK Output I2C Clock output Leave Open CC6 I2C_SDA Input/Output I2C Data Leave Open The I2C signals are open drain outputs with 2.2 kΩ pull-up resistors to VCC_1V8 internal to the AirPrime AR7550. 6.11. Voltage Reference The AirPrime AR7550 utilizes 1.8V logic. A voltage reference output for this rail is provided below.
Product Technical Specification The RESIN_N signal is pulled-up internal to the AirPrime AR7550. An open collector transistor or equivalent should be used to Ground the signal when necessary to RESET the module. Note: Use of the RESIN_N signal to RESET the AirPrime AR7550 could result in memory corruption if used inappropriately. This signal should only be used if the AirPrime AR7550 has become unresponsive and it is not possible to perform a power cycle. Table 52.
Product Technical Specification Table 54. ADC Interface Characteristics ADC ADCx Value Units Full-Scale Voltage Level 1.8 V Resolution 15 bit Input Impedance >4 MΩ 6.14. LED The AirPrime AR7550 provides an LED control output signal pad. This signal is an open drain input. Table 55. LED Interface Pad Pad Name Direction Function If Unused AA6 LED Output LED driver control Leave Open Figure 16.
Product Technical Specification Table 57. Analog Audio Interface Characteristics Analog Audio Audio IN Audio OUT Min. Typ. Max. Units Input Impedance 16 20 24 kΩ Signal Level – Differential -0.3 - 2.9 dBV Signal Level – Single-ended (the unused audio signal must be tied to GND or analog reference) -0.3 - 2.9 dBV Signal Level – Differential - - Signal Level – Single-ended -0.3 - 2.9 dBV dBV Output Impedance -0.3 - 2.
Product Technical Specification 6.15.2.1.1. PCM Data format The PCM data is 8 kHz and 16 bits with the following PDM bit format: PCM_DIN – SDDD DDDD DDDD DDVV PCM_DOUT – SDDD DDDD DDDD DDVV Where: S – Signed bit D – Data V – Volume padding 6.15.2.1.2. Primary PCM Timing The table and drawings below illustrate the PCM signals timing when the AirPrime AR7550 module is operating in Primary PCM mode. Table 60.
Product Technical Specification Figure 19. PCM Codec to AR Device Timing Diagram (Primary PCM) Figure 20. AR Device to PCM Codec Timing Diagram (Primary PCM) 6.15.2.1.3. Auxiliary PCM Timing The table and drawings below illustrate the timing of the PCM signals when the AirPrime AR7550 module is operating in Auxiliary PCM mode. Table 61. Auxiliary PCM Timing Parameter Description Min Typ Max unit T(auxsync) PCM_FS cycle time - 125 - µs T(auxsynch) PCM_FS high time 62.4 62.
Product Technical Specification Figure 21. PCM_FS Timing Diagram (128 kHz Clock) Figure 22. PCM Codec to AR Device Timing Diagram (Auxiliary PCM) Figure 23. AR Device to PCM Codec Timing Diagram (Auxiliary PCM) 6.15.2.2. I2S The AirPrime AR7550 I2S interface can be used to transfer serial digital audio to/from an external stereo DAC/ADC. The I2S interface is a 4-wire interface: serial clock (I2S_SCLK), word select (I2S_WS), serial uplink data (I2S_DIN), and serial downlink data (I2S_DOUT).
Product Te echnical Speccification Figure 24. I2S Signals Timing T Diagram m 6.15.2..2.1. I2S_DIN and a I2S_D OUT The seriial PCM stere eo-data strea am for both cchannels are e output from m the AirPrimee AR7550 on n the I2S_DOUT signal pin n and input on o the I2S_D DIN signal pin n. Serial data a is transmittted in two’s complem ment, with the MSB first.
Product Technical Specification 6.16. SPI Bus The AirPrime AR7550 embedded module provides one SPI bus (4-wire interface). SPI bus interface includes: A CLK signal An O signal An I signal A CS (Chip Select) signal 6.16.1. Characteristics The following features are available on the SPI bus: Master-only mode operation SPI speed is from 128 kbit/s to 26 Mbit/s in master mode operation 4-wire interface 4 to 32 (TBD) bits data length. 6.16.2. SPI Configuration Table 62.
Product Te echnical Speccification Table 63. SPI Master Timing T Charac cteristics 6.16.4. SPI Pin Descriptio on Refer to the following g table for th he SPI interfa ace pin descrription. Table 64. SPI Pin Description Signal Pin n# I/O O I/O Typ pe Reset R State Desscription SPI-CLK CE E4 O 1V8 Z SPI Serial Clock SPI-MISO O CE E3 I 1V8 Z SPI Serial input SPI-MOS SI CD D4 O 1V8 Z SPI Serial output SPI_CS CD D5 O 1V8 Z SPI Chip Select 6.16.5.
Product Technical Specification 6.17. HSIC Bus The AirPrime AR7550 embedded module provides one HSIC bus (2-wire interface). HSIC bus interface includes: HSIC strobe signal HSIC data signal Calibration pad for HSIC port signal 6.17.1. HSIC Pin Description Refer to the following table for the HSIC interface pin description. Table 65.
Product Technical Specification 6.17.3. Application A 4-wire SPI configuration has the input and output data lines disassociated. Figure 28. Example of HSIC Bus Application Note 1: Trace length to 10cm maximum 2: Skew between data and strobe signals < 15ps, and 3: Connect HSIC_Ready to HSIC_RST_N of the HSIC device. 41124764188 Rev 0.
Product Technical Specification 6.18. Temperature Monitoring The AirPrime AR7550 has internal temperature monitoring of both the PMIC device and the Power Amplifier devices. Application asserts ON/OFF Or Issues AT!POWERDOWN High Temperature Critical current_temp < TEMP_HI_WARN (Low power mode) current_temp > TEMP_HI_CRIT current_temp > TEMP_HI_WARN Power off. Handled by Power State state machine.
7. Routing Constraints and Recommendations Layout and routing of the AirPrime AR7550 device in the application is critical to maintaining the performance of the radio. The following sections provide guidance to the developer when designing their application to include an AirPrime AR7550 device and achieve optimal system performance. 7.1.
Product Technical Specification Poor routing Correct routing The yellow traces cross the RF trace. There is no signal around the RF path. Figure 31. RF Routing Examples Fill the area around the RF traces with ground and ground vias to connect inner ground layers for isolation. Cut out ground fill under RF signal pads to reduce stray capacitance losses. Avoid routing RF traces with sharp corners. A smooth radius is recommended. E.g. Use of 45° angles instead of 90°.
Product Technical Specification Figure 33. Antenna Microstrip Routing Example 7.2. Power and Ground Recommendations Power and ground routing is critical to achieving optimal performance of the AirPrime AR7550 devices when integrated into an application. Recommendations: Do not use a separate GND for the Antennas Connections to GND from the AirPrime AR7550 should be flooded plane using thermal reliefs to ensure reliable solder joints.
Product Technical Specification 7.4. Interface Circuit Recommendations The recommended interface implementation is to use open-drain non-inverting buffers with pull-ups to the appropriate voltage reference. This allows a host processor operating at a different voltage to communicate with the AirPrime AR7550 using the appropriate voltage levels. The figure below is a reference circuit for a digital input signal to the AirPrime AR7550 device. Figure 34.
8. Regulatory Information 8.1. Important Notice Because of the nature of wireless communications, transmission and reception of data can never be guaranteed. Data may be delayed, corrupted (i.e., have errors) or be totally lost.
Product Technical Specification 3. The AR7550 modem may transmit simultaneously with other collocated radio transmitters within a host device, provided the following conditions are met: Each collocated radio transmitter has been certfied by FCC / IC for mobile application. At least 20 cm separation distance between the antennas of the collocated transmitters and the user’s body must be maintained at all times.
9. References The table below lists the reference specifications for this product. Table 67. Reference Specifications Ref Title Issuer [1] Recommended Minimum Performance Standards for cdma2000 High Rate Packet Data Access Terminal – C.S0033 3GPP2 [2] Recommended Minimum Performance Standards for cdma2000 Spread Spectrum Mobile Stations – C.
10. Abbreviations The table below lists several abbreviations used in this document. Table 68. Abbreviations Abbreviation Description CDMA Code Division Multiple Access DRX Discontinuous Receive GNSS Global Navigation Satellite System GSM Global System for Mobile Communications HSPA High Speed Packet Access LTE Long Term Evolution SCI Slot Cycle Index USB Universal Serial Bus WCDMA Wideband Code Division Multiple Access WWAN Wireless Wide Area Network 4112476 Rev 0.
