Specifications

WA_DEV_FEX20_PTS_004 Rev 001 June 30, 2010 42
Expansion Card Product Technical
Specification
Reliability Compliance and
Recommended Standards
6.3.2.6. Handling Resistance Stress Tests
The following tests the Fastrack Xtend’s resistance to handling malfunctions and damage.
Table 43: Handling Resistance Stress Tests
Designation
Condition
ESD Test
Standard: IEC 1000-4-2
Special conditions:
 Contact discharges: 10 positive and 10 negative applied
 Voltage: ±2kV, ±4kV, ±6kV
Operating conditions: Powered
Duration: 24 hours
Operational Durability
OD
Standard: N/A
Special Conditions:
 SIM Connector:
 Cycles: 40
 Repetition Rate: 3s per cycle
 Objective: Mating and de-mating
 System Connector:
 Cycles: 40
 Repetition Rate: 3s per cycle
 Objective: Mating and de-mating
 RF Connector:
 Cycles: 20
 Repetition Rate: 5s per cycle
 Objective: Mating and de-mating
Operating conditions: Un-powered
Duration: 24 hours
Free Fall Test
FFT
Standard : IEC 60068-2-32, Test Ed
Special conditions:
 Drop: 2 samples for each direction
 Equivalent drop height: 1.5m
 Number of directions: 6 (±X, ±Y, ±Z)
 Number of drops/face: 2
Operating conditions: Un-powered
Duration:24 hours