Operating instructions

Mounting and connecting
4.3 Connecting the HMI device
MP 377, MP 377 PRO (WinCC flexible)
64 Operating Instructions, 10/2008, 6AV6691-1DR01-0AB0
Wiring diagram




 





① Chassis terminal on the HMI device, example
② Equipotential bonding conductor cross-section: 4 mm
2
③ Control cabinet
④ Equipotential bonding conductor cross-section: min. 16 mm
2
⑤ Ground connection
⑥ Cable clip
⑦ Equipotential bonding rail
⑧ Parallel routing of the equipotential bonding conductor and data cable
CAUTION
Damage to the interface modules possible
Cable shielding is not suitable for equipotential bonding.
Use only the prescribed equipotential bonding conductors. The equipotential bonding
conductor ④ must not be less than 16 mm². The interface modules may otherwise be
damaged or destroyed.