Operating instructions

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Table Of Contents

SIMATIC IPC627C
Legal information
Table of contents
1 Introduction
- 1.1 Preface
- 1.2 Guideline to the operating instructions
2 Safety notes
- 2.1 General safety instructions
3 Description
- 3.1 Overview
- 3.2 Areas of application
- 3.3 Benefits
- 3.4 Function
- 3.5 Features
- 3.6 Windows Embedded Standard 2009
- 3.7 Design
4 Application planning
- 4.1 Transport
- 4.2 Unpacking and checking the delivery unit
- 4.3 Device identification data
- 4.4 Ambient and environmental conditions
- 4.5 Permitted mounting positions
5 Mounting
- 5.1 Installing the device
- 5.2 Installing the device with mounting brackets
- 5.3 Installing the device with the vertical mounting kit
- 5.4 Installing the device with the vertical mounting kit for PC port access from the front
6 Connecting
- 6.1 Connecting peripherals
- 6.2 Connecting the 100 - 240 V AC Power Supply
- 6.3 Connecting the (24 V) DC power supply
- 6.4 Connecting equipotential bonding
- 6.5 Connecting Ethernet/USB strain relief
- 6.6 Connecting the PROFINET strain relief
7 Commissioning
- 7.1 Requirements for commissioning
- 7.2 Basic commissioning - initial startup
- 7.3 Windows XP, Windows 7 Security Center
- 7.4 Switching off the device
- 7.5 Notes on operation
8 Integration
- 8.1 Integration into an automation system
- 8.2 PROFINET
9 Functions
- 9.1 Introduction
- 9.2 Temperature monitoring
- 9.3 Watchdog (WD)
- 9.4 Fan monitoring
- 9.5 Status display
- 9.6 SRAM buffer memory
- 9.7 Battery monitoring
- 9.8 AMT (Active Management Technology)
10 Expansion and parameter assignment
- 10.1 Opening the Device
- 10.2 Memory expansion
  - 10.2.1 Removing/Installing Memory Module
- 10.3 Installing PCI/PCIe cards
  - 10.3.1 Notes on the modules
  - 10.3.2 Installing / removing expansion modules
- 10.4 Installing drives
- 10.5 Installing/removing an on-board Compact Flash card
- 10.6 Installing/removing an additional Compact Flash card
11 Service and maintenance
- 11.1 Removing and installing hardware components
- 11.2 Reinstalling the software
- 11.3 Installing the RAID Controller software
- 11.4 BIOS update
- 11.5 BIOS Recovery
12 Alarm, error, and system messages
- 12.1 Boot error messages
- 12.2 BIOS beep codes
13 Troubleshooting/FAQs
- 13.1 General problems
- 13.2 Problems when Using Modules of Third-party Manufacturers
- 13.3 Display a temperature error by means of the DiagBase application
14 Technical data
- 14.1 General Specifications
- 14.2 Current/power requirements of the device
- 14.3 AC voltage supply
- 14.4 DC power supply
15 Dimension drawings
- 15.1 Overview of the dimensional drawings
- 15.2 Dimensional drawings of the device
- 15.3 Dimensional drawings for the installation of expansion modules
16 Detailed descriptions
- 16.1 Motherboard
- 16.2 Bus board
- 16.3 System resources
  - 16.3.1 Currently allocated system resources
  - 16.3.2 System resources used by the BIOS/DOS
- 16.4 BIOS-Setup
- 16.5 AMT (Active Management Technology)
- 16.6 Communications processor CP 1616 onboard
A Appendix
- A.1 Guidelines and declarations
- A.2 Certificates and approvals
- A.3 Service and support
B ESD guidelines
C List of abbreviations
- C.1 Abbreviations
Glossary
Index
- "
- 2
- A
- B
- C
- D
- E
- F
- G
- H
- I
- L
- M
- O
- P
- R
- S
- T
- U
- V
- W

Technical data

14.1 General Specifications

SIMATIC IPC627C

116 Operating Instructions, 11/2010, A5E02669068-02

General specifications

Immunity to RF interference 10 V/m 80 to 1000 MHz and 1.4 to 2 GHz, 80% AM

(according to IEC 61000-4-3)

1 V/m 2 - 2.7 GHz, 80% AM (according to IEC 61000-4-3)

10 V 10 KHz to 80 MHz; (according to IEC 61000-4-6)

Magnetic field 100 A/m, 50 Hz (to IEC 61000-4-6)

Climatic conditions

Temperature

- Operation *

Storage/transport

- Gradient

Tested according to IEC 60068-2-1, IEC 60068-2-2, IEC

60068-2-14

+5° to +45° C

+5° to +50° C (with a total sum of max. 20 W for the slots)

+5° to +55° C (with a total sum of max. 10 W for the slot)

– 20° C to +60° C

max. 10° C/h in operation, 20° C/h storage, no

condensation

Relative humidity

-Operation

- Storage/transport

tested to IEC 60068-2-78, IEC 60068-2-30

5% to 80% at 25° C (no condensation)

5% to 95 % at 25° C (no condensation)

Atmospheric pressure

-Operation

- Storage/transport

1080 to 795 hPa

(corresponds to an altitude of -1000 to 2000 m)

1080 to 660 hPa

(corresponds to an altitude of -1000 to 3500 m)

Mech. ambient conditions

Vibration

- in operation *

- Storage/transport

tested to DIN IEC 60068-2-6

10 to 58 Hz: 0.075 mm, 58 to 500 Hz: 9.8 m/s

5 to 9 Hz: 3.5 mm, 9 to 500 Hz: 9.8 m/s

Shock resistance

- in operation *

- Storage / transport

Tested to IEC 60068-2-27, IEC 60068-2-29

50 m/s

, 30 ms,

250 m/s

, 6 ms

Special features

Quality assurance to ISO 9001

Motherboard

Chipset Mobile Intel® QM57 Express Chipset

Processor Intel® Celeron™ P4505 mobile processor 1.86 GHz,

2 MB second-level cache, 2 cores / 2 threads

Intel® Core™ i3-330E mobile processor 2.13 GHz,

3 MB second-level cache, 2 cores /4 threads,

hyperthreading, virtualization

Intel® Core™ i7-610E mobile processor 2.53 GHz,

4 MB second-level cache, 2 cores / 4 threads,

hyperthreading, turboboost and virtualization, AMT

Main memory 2 sockets maximum 4 GB SDRAM DDR3 1066

See order documentation for expansion memory

Backup memory 2 MB SRAM,

128 KB can be backed up in the buffer time