Specifications

MC55/56 Hardware Interface Description
Confidential / Released
s
MC55/56_hd_v04.00a Page 8 of 108 24.08.2006
Chapter What is new
over 2Tx, peak supply current
5.5 Corrected specification of VDDLP (RTC backup) and CCIO (SIM interface).
8 Added remark on distance from SIM to antenna and microphone.
Preceding document: "MC55/56 Hardware Interface Description" Version 02.90
New document: "MC55/56 Hardware Interface Description" Version 02.96
Chapter What is new
1.3 Deleted section “Compliance with international rules and regulations”.
3.3.1.1 Added further details of timing after power-up.
3.6.2, 3.6.6,
3.6.6.1
More detailed description of RTS wake-up.
3.12.2.2 Some text changes related to LED behavior in CYCLIC SLEEP mode.
7.2, 7.3 Deleted note on extra FCC certification for OEM products. Changed note on
recommendations for mobile and fixed devices. Added FCC labeling requirements.
Preceding document: "MC55/56 Hardware Interface Description" Version 02.06
New document: "MC55/56 Hardware Interface Description" Version 02.90
Chapter What is new
Throughout
document
Updated module images.
1.3 Added European Directives related to RoHS and WEEE.
3.5.2 Described charging procedure if battery was deeply discharged.
3.12.2.3 Same description of RING line behavior for voice, data, fax.
6.2 Deleted screw and washer restrictions for mounting holes of MC55/56.
6.1 Updated figure “Mechanical dimensions of MC55/56”
9 Siemens ordering numbers changed.
Preceding document: "MC55/56 Hardware Interface Description" Version 01.95
New document: "MC55/56 Hardware Interface Description" Version 02.06
Chapter What is new
5.7.3 Table 33: Sidetone gain at default settings for audio mode 5 and 6 set to - dB
9 Added new Siemens ordering numbers
Preceding document: "MC55/56 Hardware Interface Description" Version 01.05
New document: "MC55/56 Hardware Interface Description" Version 01.95
Chapter What is new
Throughout
document
Maximum temperature has been changed from +65°C to +70°C.
1.3 Updated list of standards.