Specifications

MC55/56 Hardware Interface Description
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MC55/56_hd_v04.00a Page 7 of 108 24.08.2006
0 Document history
Preceding document: "MC55/56 Hardware Interface Description" Version 04.00
New document: "MC55/56 Hardware Interface Description" Version
04.00a
Chapter What is new
9 Updated ordering information for MC55/56 modules.
Preceding document: "MC55/56 Hardware Interface Description" Version 03.03b
New document: "MC55/56 Hardware Interface Description" Version 04.00
Chapter What is new
3.3.1.1 Added remark on idle timeout after ignition and before sending the first AT command
(in case no hardware flow control or URCs are used/available).
Preceding document: "MC55/56 Hardware Interface Description" Version 03.03a
New document: "MC55/56 Hardware Interface Description" Version 03.03b
Chapter What is new
1.1 Updated list of related documents.
1.3 Added CE logo. Updated version number of standard “NAPRD.03”.
1.3 Compliance statement added.
2.1 Added specification IEC 60068-2. Added automatic thermal shutdown. Added TCP/IP.
3.3.3.1 Revised Table 6: Temperature dependent behavior.
3.12.2.1,
3.12.2.2
Some text changes related to SYNC pin and LED patterns.
5.2 Specified operating board/battery and ambient temperature.
5.3 Changed storage air temperature.
Preceding document: "MC55/56 Hardware Interface Description" Version 03.03
New document: "MC55/56 Hardware Interface Description" Version 03.03a
Chapter What is new
1.3 Updated version numbers of several standards.
5.7.2 Updated figure “Audio programming model”.
Preceding document: "MC55/56 Hardware Interface Description" Version 02.90
New document: "MC55/56 Hardware Interface Description" Version 03.03
Chapter What is new
1.3 Deleted WEEE Directives. Added RoHS logo.
3.5 Changed a resistor in Figure 7.
5.3 New chapter: Storage conditions
5.6 Modified typ. and max. values for voltage ripple, SLEEP mode, IDLE mode, GPRS