Specifications

MC55/56 Hardware Interface Description
Confidential / Released
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MC55/56_hd_v04.00a Page 5 of 108 24.08.2006
Figures
Figure 1: MC55/56 block diagram ........................................................................................
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Figure 2: Power supply limits during transmit burst ..............................................................
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Figure 3: Power-on by ignition signal....................................................................................
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Figure 4: Timing of power-on process if VDDLP is not used ................................................
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Figure 5: Timing of power-on process if VDDLP is fed from external source........................
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Figure 6: Deactivating GSM engine by /EMERGOFF signal.................................................
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Figure 7: Schematic of approved charging transistor, trickle charging and ESD protection..
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Figure 8: Battery pack circuit diagram ..................................................................................
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Figure 9: Charging process ..................................................................................................
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Figure 10: Timing of /CTS signal (example for a 2.12 s paging cycle)..................................
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Figure 11: Beginning of power saving if CFUN=5 or 7..........................................................
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Figure 12: RTC supply from capacitor..................................................................................
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Figure 13: RTC supply from rechargeable battery................................................................
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Figure 14: RTC supply from non-chargeable battery............................................................
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Figure 15: Serial interfaces ..................................................................................................
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Figure 16: Audio block diagram............................................................................................
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Figure 17: Schematic of microphone inputs .........................................................................
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Figure 18: DAI timing on transmit path .................................................................................
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Figure 19: DAI timing on receive path ..................................................................................
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Figure 20: SIM card holder of DSB45 Support Box ..............................................................
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Figure 21: Pin numbers of Molex SIM card holder on DSB45 Support Box ..........................
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Figure 22: SYNC signal during transmit burst ......................................................................
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Figure 23: LED Circuit (Example) .........................................................................................
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Figure 24: Incoming voice call..............................................................................................
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Figure 25: URC transmission ...............................................................................................
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Figure 26: U.FL-R-SMT connector .......................................................................................
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Figure 27: Antenna pad and GND plane ..............................................................................
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Figure 28: Never use antenna connector and antenna pad at the same time.......................
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Figure 29: Restricted area around antenna pad ...................................................................
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Figure 30: Mechanical dimensions of U.FL-R-SMT connector..............................................
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Figure 31: U.FL-R-SMT connector with U.FL-LP-040 plug ...................................................
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Figure 32: U.FL-R-SMT connector with U.FL-LP-066 plug ...................................................
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Figure 33: Specifications of U.FL-LP-(V)-040(01) plug.........................................................
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Figure 34: Pin assignment (top view on MC55/56) ...............................................................
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Figure 35: Typical current consumption vs. PCL in EGSM 900 network...............................
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Figure 36: Typical current consumption vs. PCL in GSM 1800 network ...............................
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Figure 37: Typical current consumption PCL in GSM 1900 network.....................................
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Figure 38: Peak current consumption during transmit burst vs. PCL in EGSM 900 network.
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Figure 39: Peak current consumption during transmit burst vs. PCL in GSM 1800 network .
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Figure 40: Peak current consumption during transmit burst PCL in GSM 1900 network.......
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Figure 41: Typical current consumption vs. return loss.........................................................
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Figure 42: Audio programming model ..................................................................................
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Figure 43: MC55/56 – top view.............................................................................................
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Figure 44: MC55/56 bottom view..........................................................................................
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Figure 45: Mechanical dimensions of MC55/56....................................................................
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Figure 46: Hirose DF12C receptacle on MC55/56..............................................................
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Figure 47: Header Hirose DF12 series ...............................................................................
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Figure 48: Mechanical dimensions of Hirose DF12 connector............................................
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Figure 49: Reference equipment for approval ....................................................................
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Figure 50: Schematic diagram of MC55/56 sample application ..........................................
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