Datasheet

Product Specification
www.shuttle.com
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. [phone]
Fax [phone]
[e-mail]
©2006 by Shuttle Computer Handels GmbH (Germany). All Information subject to change without notice. Pictures for illustration puposes only.
Pa
g
e 5
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18 Jul
y
2008
Shuttle XPC Barebone SX48P2 Deluxe Specifications
Special
Deluxe-
Features
Fingerprint recognition technology
Speed-Link - easily connect 2 PCs via USB and share data
Wireless LAN 802.11b/g, up to 54 Mbit/s data transfer rate
Bluetooth 2.0 dongle
Chassis
P2-type aluminum chassis, color: black
storage bays: 1 x 5.25", 3 x 3.5" (2 internal)
stealthed drive doors
dimensions: 32.5 x 22 x 21 cm (LWH)
weight: 4.2 kg net / 6.0 kg gross
Mainboard
Shuttle FX48, Shuttle form factor, proprietary design for XPC SX48P2 Deluxe
Chipset: Intel X48 Express (MCH) + ICH9R (I/O Conroller Hub)
Solid Capacitors for excellent heat resistance for enhanced system durability
Color slots/connectors design (Power switch, USB, PCIe, DDR3)
Dimensions: 20.5 x 28 cm
Power
Supply
450 Watt ATX mini PSU, AC input voltage: 100~240V
80 PLUS® certified (80% or greater energy-efficient)
Dimensions: 85(W) x 83(H) x150(D) mm
Connectors: 20-pin ATX, 4-pin ATX12V
Active PFC circuit (Power Factor Correction)
With AC power switch
Processor
Support
Socket 775 supports Intel processors with Core technology
Supports 800, 1066, 1333 or 1600MHz front side bus (FSB)
Supports Core 2 Quad/Extreme/Duo, Pentium Dual-Core, Pentium D
Supports Core 2 multi-core processors in 45nm technology
Please refer the support list for detailed processor support information:
http://global.shuttle.com/support_list.jsp
Over-
clocking *)
CPU frequency, CPU voltage, RAM frequency, RAM voltage
Dynamic Overclock feature (DOC):
Easily overclock from 3/5/7/10% through the BIOS.
Cooling
system
Shuttle I.C.E. heat-pipe module (Integrated Cooling Engine)
SilentX Cooling and Noise Reduction Technology
advanced Heatpipe technology, linear fan control.
3 independent airflow zones: CPU, HDD and Case
(including power supply, mainboard and graphics card)
OASIS Cooling Technology: additional fanless heat-pipe design
covering the MOSFET modules (VRM), north- and southbridge