Datasheet

Product Specification
www.shuttle.eu
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
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© 2014 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice. Pictures for illustration purposes only.
Shuttle XPC Barebone SH81R4 - Specifications
R4-Chassis
Black aluminium chassis with acrylic front plate
Customisable front panel design: simply change the mylar and add a personal design
such as a photo, graphics or a logo to the front panel.
Storage bays: 1 x 5.25" (external), 2 x 3.5" (internal)
Dimensions: 32.5 x 21.5 x 19 cm (LWH) = 13.3 liters (without rubber feet)
Weight: 3.4 kg net / 4.5 kg gross
Mainboard
and Chipset
Shuttle mainboard FH81, Shuttle form factor, proprietary design for XPC SH81R4
Chipset/Southbridge: Intel® H81 (code name: Lynx Point)
Platform Controller Hub (PCH) Intel® DH82H81
Passive chipset cooling with heat sink
The Northbridge is integrated into the processor.
Solid Capacitors for sensitive areas provide excellent heat resistance for enhanced
system durability
BIOS
A
MI BIOS, SPI Interface, 32MBit Flash-ROM
Supports PnP, ACPI 3.0, Hardware Monitoring
Supports boot up from external USB flash memory
Supports Unified Extensible Firmware Interface (UEFI) [2]
Power Supply
Builtin 300 Watt mini switching power supply (model PC61J)
AC input voltage: 100~240V, 50~60 Hz
80 PLUS Bronze compliant: The PSU provides at least
82/85/82% of efficiency at 20/50/100% of load.
Active PFC circuit (Power Factor Correction)
ATX main power connectors: 2x10 and 2x2-pin
Graphics power connector: 6-pin
Other connectors: 4x SATA, 2x Molex, 1x Floppy
Processor
Support
Socket LGA 1150 (H3) supports the fourth generation of
Intel Core i7 / i5 / i3, Pentium and Celeron processors
Maximum supported processor power consumption (TDP) = 95W
Codename "Haswell", 22nm process technology, up to 8 MB of L3 cache
Does not support the unlock-function of Intel K-Series processors.
The processor integrates PCI-Express, memory controller
and the graphics engine on the same die (depends on processor type)
Please refer to the support list for detailed processor support information.
Heatpipe
Processor
Cooling
Shuttle I.C.E. (Integrated Cooling Engine)
advanced I.C.E. heatpipe technology, linear-controlled 92mm fan
SilentX cooling and noise reduction technology with Active Airflow
Memory
Support
2 x 240-pin slots
Supports DDR3-1600 SDRAM memory (PC3-12800)
Supports Dual Channel mode
Supports max. 8 GB per DIMM and a maximum total capacity of 16 GB