Datasheet

Product Specification
www.shuttle.com
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
Fax +49 (0) 4121-47 69 00
sales@shuttle.eu
©2006 by Shuttle Computer Handels GmbH (Germany). All Information subject to change without notice. Pictures for illustration puposes only.
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Shuttle XPC Barebone SH55J2 Specifications
Chassis
J2-type, color: black
Case cover made of aluminum, body made of steel
storage bays: 1 x 5.25" (external), 2 x 3.5" (internal)
Front door for I/O ports / card reader and optical drive
Kensington Security Slot at the back panel (also called a K-Slot
or Kensington lock) as a part of an anti-theft system
Dimensions: 33 x 21,5 x 19 cm (LWH), 13.5 litres
Weight: 7.0 kg net / 7.8 kg gross
Compatible with Mainboards in Shuttle or Mini-ITX Form Factor
Mainboard
and Chipset
Shuttle FH55, Shuttle form factor, proprietary design for XPC SH55J2
Chipset: Intel® H55 Express (Codename: Ibex Peak, 65nm process)
Platform Controller Hub (PCH) as Single-Chip-Solution
BIOS
AMI BIOS, SPI Interface, 16MBit Flash-ROM
Supports PnP, ACPI 3.0
Supports boot up from external USB flash memory
Power Supply
300 Watt mini PSU, AC input voltage: 100~240V
80 PLUS® certified (80% or greater energy-efficient)
Active PFC circuit (Power Factor Correction)
ATX main power connectors: 2x10 and 2x2 pins
Processor
Support
Socket 1156 supports Intel Core i3 / i5 /i7 processors
Supports Intel QuickPath Interconnect (QPI) at 4.8 and 6.4 GT/s
Supports maximum TDP = 95W (power consumption)
The Processor integrates PCI-Express and memory controller '
and the graphics engine as an option.
Please refer to the support list for detailed processor support information.
Processor
Cooling
Shuttle I.C.E. (Integrated Cooling Engine)
advanced I.C.E. Heatpipe technology, linear controlled 92mm fan
SilentX cooling and noise reduction technology with Active Airflow
Memory
Support
4 x 240 pin slots
Supports DDR3-1066/1333 SDRAM memory (PC3-8500/10600)
Supports DDR3-1600 (PC3-12800) in overclocking mode *)
Supports 2+2 Dual Channel mode
Supports max. 4 GB per DIMM, maximum total size of 16 GB
Integrated
graphics
The Intel Core i3/i5 32nm Clarkdale processor integrates the
Intel® HD Graphics engine with Flexible Display Interface (FDI)
Resolution max. 1920 x 1200 (supports 720p, 1080i und 1080p)
Decodes MPEG-2, H.264 and VC-1 in hardware (supports Blu-ray)
Supports DirectX 10, OpenGL 2.1, Shader 4.0
Supports Dual-Independent-Display via HDMI and VGA port