Datasheet
Product Specification
www.shuttle.com
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. +49 (0) 4121-47 68 60
Fax +49 (0) 4121-47 69 00
sales@shuttle.eu
Pa
g
e 8
|
17 Januar
y
2012
©2012 Shuttle Computer Handels GmbH (Germany). All information subject to change without notice. Pictures for illustration purpose only.
Shuttle XPC Barebone SZ68R5 Specifications
R5-Chassis
Black aluminum chassis
Storage bays: 1 x 5.25" (external), 2 x 3.5" (1x internal, 1x external)
Front door for I/O ports and storage drives
Kensington Security Slot at the back panel (also called a K-Slot
or Kensington lock) as a part of an anti-theft system
Dimensions: 33 x 21,5 x 19 cm (LWH), 13.5 litres
Weight: 3.6 kg net / 5.0 kg gross
Mainboard
and Chipset
Shuttle FZ68, Shuttle form factor, proprietary design for XPC SZ68R5
Chipset/Southbridge: Intel® Z68 Express (Codename: Cougar Point)
Platform Controller Hub (PCH) as Single-Chip-Solution
Passive chipset cooling with heat sink
The Northbridge is integrated into the processor.
Solid Capacitors for sensitive areas provide excellent
heat resistance for enhanced system durability
BIOS
AMI BIOS, SPI Interface, 32MBit Flash-ROM with SPI interface
Supports PnP, ACPI 3.0, Hardware Monitoring
Supports Unified Extensible Firmware Interface (UEFI) (3)
Supports boot up from external USB flash memory
Power Supply
500 Watt mini PSU, AC input voltage: 100~240V
80PLUS Bronze compliant: the PSU provides at least
82/85/82% efficiency at 20/50/100% load.
Active PFC circuit (Power Factor Correction)
ATX main power connectors: 2x10 and 2x2 pins
Graphics power connector: 6 and 6+2 pins
Processor
Support
Socket 1155 (LGA 1155) supports the second generation of
Intel Core i3 / i5 / i7 desktop processors with up to 95W TDP
Codename "Sandy Bridge", 32nm process technology
Not compatible with older Socket-1156 processors.
The Processor integrates PCI-Express, memory controller
and the graphics engine on the same die
Please refer to the support list for detailed processor support information.
Processor
Cooling
Shuttle I.C.E. (Integrated Cooling Engine)
advanced I.C.E. Heatpipe technology, linear controlled 92mm fan
SilentX cooling and noise reduction technology with Active Airflow
Memory
Support
4 x 240 pin slots
Supports DDR3-1066/1333 SDRAM memory (PC3-8500/10600)
Supports 2+2 Dual Channel mode
Supports max. 8 GB per DIMM, maximum total size of 32 GB










