Instructions
Product Specifications
w w w . s h u t t l e . e u
Shuttle C omputer Handels G m bH
Fr itz -Stra ssma nn- St r . 5
25337 Elmshor n | German y
Tel. +49 (0) 4121-47 68 60
Fax +49 (0) 4121 -47 69 00
E- Mail: s ales@ sh utt le. eu
Page 7 | 25 October 2019
© 2019 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice
. Pictures for illustration purposes only.
Shuttle XPC all-in-one P51U – Specifications
Fanless and
silent
Passive heatpipe cooling, absolutely no fan noise
Perfect for noise-sensitive environments
Fanless, dust-free and thus virtually maintenance-free
24/7
nonstop
operation
This device is approved for 24/7 permanent operation.
Requirements:
- Free circulation of air amongst the PC must be guaranteed.
- Ventilation holes must be kept clear.
- If a hard disk is installed, this must also be approved for permanent
operation by its manufacturer.
IP54
protected
The front panel is dust-protected and protected from
splashing of water according to protection class IP54.
Chassis
Colour: black
Dimensions: 393.6 x 272.5 x 39.8 mm (W x H x D)
100 mm VESA mountable
Hole for Kensington lock
Weight: 3.25 kg net, 4.5 kg gross
Operation
System
This system comes without operating system.
It is compatible with:
- Windows 10 (64-bit)
- Linux –(64-bit)
Touchscreen
Touchscreen function supports fingertip input
Capacitive Touch Panel with 10-point multitouch
Supports input with gloves (PVC, cotton, cotton/linen)
Stylus pen not supported
15.6”
Display
39.6 cm / 15.6" LC display, IPS technology
Ratio: 16:9 wide-screen panel
Native resolution: 1920 x 1080 = 2 Megapixel (Full HD / 1080p)
Brightness: 250 cd/sqm
Processor
Model: Intel Celeron 4205U (ULV)
System-on-a-chip architecture (SoC) with integrated memory and graphics controller: no
chipset required
FCBGA1528 package - directly soldered onto the mainboard
Code name: Whiskey Lake U (8th Generation Intel Core)
Cores / Threads: 2 / 2, Clock rate: 1.8 GHz
L1/L2/L3 Cache: 128 kB / 512 kB / 2048 kB
TDP wattage: 15 W maximum
Manufacturing process: 3rd-generation enhanced 14nm++
Maximum Tjunction Temperature: 100 °C
Supports 64-bit, VT-x (EPT), VT-d, Enhanced SpeedStep, NX bit, AES-NI, SSE 4.1/4.2