Datasheet

Product Specifications
www.shuttle.eu
Shuttle Computer Handels GmbH
Fritz-Strassmann-Str. 5
25337 Elmshorn | Germany
Tel. [phone]
Fax [phone]
[e-mail]
Pa
g
e 10 10 A
p
ril 2014
© 2014 by Shuttle Computer Handels GmbH (Germany). All information subject to change without notice. Pictures for illustration purposes only.
Conformity
Certifications
EMI: FCC, CE, BSMI, C-Tick
Safety: CB, BSMI, ETL, CCC
This device is classed as a technical information equipment (ITE) in class B and is
intended for use in living room and office. The CE-mark approves the conformity by the
EU-guidelines:
- EMV-guideline 89/336/EWG electromagnetic tolerance
- LVD-guideline 73/23/EWG use of electric devices within certain voltage-limits
Footnote:
[1] Unified Extensible Firmware Interface (UEFI) - required when booting from hard disks larger than 2.2 TB
[2] LPC port
This expansion slot is compatible with the following TPM 1.2 modules:
- Asus TPM Trusted Platform Module TPM/FW3.19
- GIGABYTE TPM-Module GCTPMR-00-Gl
[3] mini-SATA (mSATA)
not to be confused with the "micro SATA" connector, is a newer industry standard which converts the electrical SATA
interface (1.5 or 3.0 Gbit/s) to the pysical "Mini PCI Express" mini card form factor.
[4] Four pin header at the back panel
This header allows for connecting an external power button.
It also provides 5V DC voltage for external devices and the Clear CMOS function.
[5] Caution: for high ambient temperature over 35°C we strongly recommend to use SSDs (supporting at least 70°C)
and rugged SODIMM memory with wide temperature range (up to 95°C).
Suggested vendors for rugged memory modules:
Samsung: http://www.samsung.com/global/business/semiconductor/product/computing-dram/catalogue?iaId=690
Elpida: http://www.elpida.com/en/products/ddr3module.html
Micron: http://www.micron.com/products/dram/ddr3-sdram#fullPart&186=1&219=3,4,5,6&220=3
Supplied accessory: VESA mount with screws