Specifications

深圳市朋伴兴业科技有限公司
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深圳市朋伴兴业科技有限公司
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DRAWN BY : Sera
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TITLE：CHIP2450-1608 Specification
DOCUMENT
NO.
1608
SPEC REV.
P1
8
8. Recommended Reflow Soldering
(1) Soldering Gun Procedure
Note the follows, in case of using solder gun for replacement.
(a) The tip temperature must be less than 350
°
C for the period within 3 seconds by
using soldering gun under 30 W.
(b) The soldering gun tip shall not touch this product directly.
(2) Soldering Volume
Note that excess of soldering volume will easily get crack the body of this product.