User's Manual

Grouped
equipment
×
○
○
○
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This form is compiled in accordance with
SJ/T 11364.
○: Indicates that the content of this toxic and
hazardous substance in all homogeneous
materials of this part is below the limit
requirement of GB/T 26572.
×: Indicates that the content of the toxic and
hazardous substance in at least one of the
homogeneous materials of the part exceeds
the limit requirement of GB/T 26572.
Explain
1. Structural parts: the steel, aluminum or copper contains
lead.
2. Single board/circuit module:
• The PCB surface pad contains lead.
• Single-board ceramic/through core/mica capacitors: The
ceramic core contains lead.
• The internal resistance of Zhongzhen is exempt from
lead.
• High temperature solder with lead content above 85% is
used for the internal connection points of the transformer.
• Some internal component pins and solder contain lead.
• SMD inductor lead is used in optical glass.
• The high temperature solder used for soldering transistor
chips is leaded solder.
• Exemption for lead in resistance layer and protective
layer glass.
• The pins and solders of IC, power supply and other
components on the board contain lead.
3. Cable connectors: most of the connector metal shells,
terminals, etc. contain lead, and the pins contain lead.
4. If there are batteries and remote controls in the
supporting equipment, such devices also contain lead。