Specifications

HM-WF1200
E-mail:[e-mail] www.hoperf.com Rev1.0
1. Overview
The HM-WF1200 module is developed by Shenzhen Hope Microelectronics Co., Ltd. It
uses the OPL1200 SoC chip and the main feature of the OPL1200 chip is the addition of
8M-bit embedded flash memory as the main flash memory of the system. The 8M-bit
embedded flash is used to store user applications and system patches. OPL1200 SoC chip
has a fully integrated 2.4GHz radio transceiver and a baseband processor for Wi-Fi
802.11b and Smart Bluetooth applications. It can be used as a standalone
application-specific communication processor or as a wireless data link in a hosted MCU
system, as well as extremely low power. It supports a flexible memory architecture for
storing profiles, stacks and custom application code, and can be updated using
Over-The-Air (OTA) technology. Smart Bluetooth protocol stack and Wi-Fi TCP/IP stack
are stored in dedicated ROM. OPULINKS OPL1200 SoC is equipped with ARM® dual
processors Cortex-M0 and M3 to handle different processes. All software runs on the
ARM®Cortex®-M0 processor, while the more intensive application-specific activities
run on the ARM®Cortex®-M3 processor. Any external MCU can be connected via SPI,
I2C or UART interface, and sensors or other devices can be connected via GPIOs. The
transceiver interface is directly connected to the antenna, which is fully compliant with
Wi-Fi 802.11b and Bluetooth 5.0 BLE standards. Integrating antenna switch, radio
frequency balun, power amplifier (PA) and low noise amplifier (LNA), OPL1200 allows
Wi-Fi and Smart Bluetooth to minimize PCB area design and external component
requirements. The functional block diagram of OPL1200 is shown below.