Specifications

RF-BM-4044B2
www.szrfstar.com Ver1.1 - Aug., 2018
Shenzhen RF-star Technology Co., Ltd. Page 3 of 13
Table of Contents
1 Device Overview ............................................................................................................................................................ 1
1.1 Description .......................................................................................................................................................... 1
1.2 Key Features .................................................................................................................................................. 1
1.3 Applications ........................................................................................................................................................ 1
1.4 Functional Block Diagram .................................................................................................................................. 2
Table of Contents .............................................................................................................................................................. 3
Table of Figures ................................................................................................................................................................. 4
Table of Tables .................................................................................................................................................................. 4
2 Module Configuration and Functions ............................................................................................................................. 5
2.1 Module Parameters ............................................................................................................................................ 5
2.2 Module Pin Diagram ........................................................................................................................................... 6
3.3 Pin Functions ...................................................................................................................................................... 6
3 Specifications ................................................................................................................................................................. 7
3.1 Recommended Operating Conditions ................................................................................................................ 7
3.2 Power Consumption ........................................................................................................................................... 7
3.2 RF Test ............................................................................................................................................................... 7
4 Application, Implementation, and Layout ....................................................................................................................... 8
4.1 Module Photos .................................................................................................................................................... 8
4.2 Recommended PCB Footprint ........................................................................................................................... 9
4.3 Typical Application Circuit ................................................................................................................................. 10
4.4 Basic Operation of Hardware Design ............................................................................................................... 10
4.5 Trouble Shooting ............................................................................................................................................... 11
4.5.1 Unsatisfactory Transmission Distance ................................................................................................... 11
4.5.2 Vulnerable Module ................................................................................................................................. 11
4.5.3 High Bit Error Rate ................................................................................................................................ 12
4.6 Electrostatics Discharge Warnings ................................................................................................................... 12
4.7 Soldering and Reflow Condition ....................................................................................................................... 12
5 Certification .................................................................................................................................................................. 13
5.1 FCC warnings ................................................................................................................................................... 13
6 Revision History ........................................................................................................................................................... 13