Specifications

RF-BM-BG22B1
www.szrfstar.com
Shenzhen RF-star Technology Co., Ltd. Page 4 of 15
Table of Contents
1 Device Overview ............................................................................................................................................................. 1
1.1 Module Series ..................................................................................................................................................... 1
1.2 Description............................................................................................................................................................ 1
1.3 Key Features ....................................................................................................................................................... 1
1.4 Applications .......................................................................................................................................................... 2
1.5 Functional Block Diagram .............................................................................................................................. 3
1.6 Part Number Conventions .............................................................................................................................. 3
Table of Contents ................................................................................................................................................................ 4
2 Module Configuration and Functions ...................................................................................................................... 5
2.1 Module Parameters ........................................................................................................................................... 5
2.2 Module Pin Diagram ......................................................................................................................................... 6
2.3 Pin Functions ....................................................................................................................................................... 6
3 Specifications ................................................................................................................................................................... 7
3.1 Recommended Operating Conditions ....................................................................................................... 7
3.2 Handling Ratings ................................................................................................................................................ 7
4 Application, Implementation, and Layout............................................................................................................... 8
4.1 Module Photos .................................................................................................................................................... 8
4.2 Recommended PCB Footprint ...................................................................................................................... 8
4.3 Antenna .................................................................................................................................................................. 9
4.3.1 Antenna Design Recommendation ................................................................................................ 9
4.4 Basic Operation of Hardware Design ........................................................................................................ 9
4.5 Trouble Shooting .............................................................................................................................................. 10
4.5.1 Unsatisfactory Transmission Distance ........................................................................................ 10
4.5.2 Vulnerable Module .............................................................................................................................. 11
4.5.3 High Bit Error Rate ............................................................................................................................. 11
4.6 Electrostatics Discharge Warnings ........................................................................................................... 11
4.7 Soldering and Reflow Condition ................................................................................................................. 11
4.8 Optional Packaging ......................................................................................................................................... 13
6 Revision History ............................................................................................................................................................ 14
7 Contact Us ....................................................................................................................................................................... 15