Specifications
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Shenzhen RAKwireless Technology Manuals
Electronics
LoRa Module
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2.4 Recommend
ed Footp
rint
Figure 5 |
Recomm
ended Footprint
2.5 Recommend
ed Reflo
w Profile
Figure 6 |
Recomm
ended Reflow Profile
Standard conditions f
or reflow soldering:
Pre-heating Ram
p (A) (Initial tem
perature: 150
℃
): 1~2.5
℃
/sec;
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